Intel Corporation

Kenan Huseyin Arik

Mark E Sprenger

David Shia

Ralph V Miele

Barrett M Faneuf

Aaron P Anderson

Brendan T Pavelek

Carlos Alvizo Flores

Minh T D Le

Aleksander Magi

Paul J Gwin

Jeffory L Smalley

Sandeep Ahuja

Phil Geng

Casey R Winkel

Drew G Damm

Marc Milobinski

Fernando Gonzalez Lenero

Jun Zhang

Damion T Searls

David Pidwerbecki

Richard J Dischler

Jin Yang

Hemant D Desai

Bijoyraj Sahu

Eric W Buddrius

David A Rittenhouse

Eric Dwight McAfee

Brian S Jarrett

Prabhakar Subrahmanyam

Catharina Biber

Joseph Andrew Broderick

Ying-Feng Pang

Michael S Brazel

Michael Berktold

Kristin L Weldon

Yi Xia

Victor Polyanko

Javier Avalos Garcia

Yuyang Xia

Lianchang Du

Eric D Mcafee

Luz Karine Sandoval Granados

Mark Bianco

Adriana Lopez Iniguez

Yuehong Fan

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Couplings are disclosed herein. A plug of a coupling includes a plug body and a socket interface coupled to the plug body. The socket interface includes a shoulder extending axially outward from the plug body, a neck extending axially outward and radially inward from the shoulder, and a socket guide extending axially outward and radially outward from the neck.

Universal quick disconnect

Particular embodiments described herein provide for an electronic device, that includes a display and a bounce reduction mechanism configured to provide an active counterforce to a force on the display. In an example, a proximity sensor can detect when a device is going to create the force on the display. In another example, a screen bounce detection engine to detect oscillations of the display and the bounce reduction mechanism is configured to provide an active counterforce to dampen oscillation of the display.

Reduction of touchscreen bounce

The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the 'Z' height of the computing device may be minimized in addition to reducing costs.

Fastenerless hinge which enables thin form factor low cost design

Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.

Flexible thermally-conductive shunt

In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.

360 degree hinge assembly for electronic devices

In one example an electronic device comprises at least one electronic component and a body formed from a rigid material and comprising a first major surface and a second major surface opposite the first major surface, the body comprising at least one aperture extending between the first major surface and the second major surface and a cover formed from a semi-rigid material extending over the at least one aperture, wherein a portion of the cover extends through the aperture and is connected to the second major surface of the body. Other examples may be described.

Spill resistant chassis for electronic device

Particular embodiments described herein provide for a serviceable chassis. The serviceable chassis can include a first housing and a second housing. The first housing includes a locking arm. The second housing can include a locking cam and a cord. The cord is attached to the locking cam and can rotate the locking cam to engage and disengage the locking arm to couple and uncouple the first housing to the second housing.

Serviceable chassis for devices

Growing community of inventors

Hillsboro, OR, United States of America

Kenan Huseyin Arik