United Microelectronics Corp.

Ken Yew

Eric Chu

Ling-Hsin Tseng

Kevin Chiang

The present invention relates to a cooling system of a furnace, and more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened. When inside the process tube not proceeds the high temperature process, the first gas cooling cycle and the second gas cooling cycle are closed and the second liquid cycle is opened at the same time. The heat sinks and the heat insulation slot are on the door to increase the heat conduction efficiency of the door and to extend the lifetime of the elements on the door. The first liquid cooling cycle and the second cooling cycle are the independent cooling systems to each other. The first flange is located between the door and the second flange.

Cooling system for reducing particles pollution

The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The probability of pollution by particles can be decreased and the lifetime of the furnace devices can be extended by using different liquid and gas cycles, cooling the different steps the semiconductor processes in the furnace.

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Hsin-Chu, Taiwan

Ken Yew