Olympus Corporation

Sony Corporation

Ken Yamamoto

Takuro Suyama

Takatoshi Igarashi

Hiroshi Kobayashi

Kazuhiro Yoshida

Naoto Yoshikawa

Takahiro Shimohata

Masahisa Tamura

Kensuke Suga

Takeshi Matsubara

Shunsuke Sakazume

An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.

Image pickup apparatus and endoscope

A manufacturing method of an image pickup apparatus includes: fabricating a plurality of image pickup members each having a light-receiving surface on which a transparent plate is disposed and a plurality of spacers; measuring thicknesses of the transparent plates and the spacers; classifying the image pickup members into first groups depending on the thicknesses of the transparent plates; classifying the spacers into second groups depending on the thicknesses, selecting a combination of any one of the first groups and any one of the second groups such that a sum of the thickness of each of the transparent plates and the thickness of each of the spacers is within a predetermined range with a focusing length of optical members as a center; fabricating stacked bodies by stacking the image pickup members and the spacers in the selected combination; and disposing the optical members on the spacers in the stacked bodies.

Manufacturing method of image pickup apparatus, and image pickup apparatus

An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

Image pickup apparatus, method of manufacturing image pickup apparatus, and endoscope

An endoscope system includes an endoscope having an insertion portion. The endoscope is attached to the proximal end of the insertion portion. An image capturing module is attached to the distal-end portion of an insertion portion. The image capturing module includes a wiring board having a principal surface including first electrodes and second electrodes disposed thereon. An image capturing element includes respective photodetection and reverse surfaces. The reverse surface includes external electrodes and is connected to the first electrodes on the wiring board. A prism having an entrance surface to which light is applied, a reflection surface, and an exit surface in which the exit surface being bonded to the photodetection surface of the image capturing element. A support member is used to support the prism. A layered element including a plurality of elements is layered together and having an upper surface, a lower surface with element electrodes disposed thereon.

Endoscope system and method of manufacturing an image capturing module used in the endoscope system

A manufacturing method of an optical unit for endoscope includes: a process of crimping a bonding sheet including a curable resin film to a release substrate having a release surface which is an optical flat surface; a mirror-finishing process of performing a partial curing treatment on a predetermined region of the bonding sheet to process the predetermined region into an optical flat surface; a process of fabricating a laminated wafer by laminating a first element wafer including a first optical element and a second element wafer including a second optical element, with the bonding sheet being arranged between the first element wafer and the second element wafer; a curing process of performing a curing treatment on an uncured region of the bonding sheet; and a process of cutting the laminated wafer and segmenting the laminated wafer into optical units.

Manufacturing method of optical unit for endoscope, optical unit for endoscope, and endoscope

An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

Image pickup module and endoscope

The present technology relates to a phase locked loop and a control method therefor, which are capable of achieving low power consumption and good phase noise while suppressing the growth of circuit area. The phase locked loop includes: a digitally controlled oscillation unit that controls an oscillation frequency by a control signal in a digital format; a multiphase clock generation unit that generates clock signals with multiple phases synchronized with the digitally controlled oscillation unit; a clock selection unit that selects a selected clock signal out of the clock signals with multiple phases; a time-to-digital conversion unit that detects a time difference between the selected clock signal and a reference clock signal; a counter unit driven by any one clock signal out of the clock signals with multiple phases; a reference phase generation unit that generates a reference phase; a phase comparison unit that compares feedback phase information obtained from an output value of the counter unit and an output value of the time-to-digital conversion unit with the reference phase; and a digital loop filter unit that smooths output of the phase comparison unit and generates the control signal for the digitally controlled oscillation unit.

Phase locked loop and control method therefor

Provided with one or more first transistors of a first conductivity type each including a gate, a source, and a drain, the gate being connected to an input terminal, the source being configured to be connected to a first voltage source, the drain being connected to an output node, one or more second transistors of a second conductivity type each including a gate, a source, and a drain, the gate being connected to the input terminal, the source being configured to be connected to a second voltage source, the drain being connected to the output node, a first resistor that is inserted and connected between the input terminal and the output node, a first output terminal that is connected to the input terminal, and a second output terminal that is directly or indirectly connected to the output node.

Growing community of inventors

Nagano, Japan

Ken Yamamoto