Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Other

Hitachi Ulsi Engineering Corp.

Ken Tsugane

Hideo Aoki

Isamu Asano

Yoshinao Kawasaki

Tsuyoshi Tamaru

Masakazu Sagawa

Nobuo Owada

Osamu Tsuchiya

Toru Kaga

Fumio Ootsuka

Kazuyoshi Torii

Hiromichi Enami

Mitsuaki Horiuchi

Jun Sugiura

Osamu Kasahara

Hidetsugu Ogishi

Makoto Ogasawara

Keisuke Funatsu

Masatoshi Tsuneoka

Takayoshi Kogano

Seiichirou Shirai

Atsushi Wakahara

Hiroyuki Akimori

Sinichi Suzuki

Yoshihiro Ikeda

Tomotsugu Shimmyo

Tunehiko Tubone

Nobuhiro Otsuka

Herein disclosed is a semiconductor integrated circuit device fabricating process for forming MISFETs over the principal surface in those active regions of a substrate, which are surrounded by inactive regions formed of an element separating insulating film and channel stopper regions, comprising: the step of for forming a first mask by a non-oxidizable mask and an etching mask sequentially over the principal surface of the active regions of the substrate; the step of forming a second mask on and in self-alignment with the side walls of the first mask by a non-oxidizable mask thinner than the non-oxidizable mask of the first mask and an etching mask respectively; the step of etching the principal surface of the inactive regions of the substrate by using the first mask and the second mask; the step of forming the element separating insulating film over the principal surface of the inactive regions of the substrate by an oxidization using the first mask and the second mask; and the step of forming the channel stopper regions over the principal surface portions below the element separating insulating film of the substrate by introducing an impurity into all the surface portions including the active regions and the inactive regions of the substrate after the first mask and the second mask have been removed.

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AND A TRANSITION-METAL NITRIDE FILM BETWEEN THE ALUMINUM WIRING STRIP AND THE TRANSITION-METAL FILM

Herein disclosed is a semiconductor integrated circuit device fabricating process for forming MISFETs over the principal surface in active regions of a substrate, which are surrounded by inactive regions formed of an element separating insulating film and channel stopper regions. The disclosed process includes forming insulating films over wiring lines including uppermost wiring lines, the uppermost wiring lines having gaps between adjacent uppermost wiring lines. The insulating films include forming a silicon oxide film over the wiring lines and in the gaps between adjacent uppermost wiring lines, and forming a silicon nitride film over the silicon oxide film, the silicon nitride film being formed by plasma chemical vapor deposition. The silicon oxide film is formed to have a thickness of at least one-half of the gap between adjacent uppermost wiring lines, with the silicon nitride film being thicker than the silicon oxide film.

Semiconductor integrated circuit device, process for fabricating the

Method of forming teos oxide and silicon nitride passivation layer on

Semiconductor integrated circuit device process for fabricating the same

Growing community of inventors

Ohme, Japan

Ken Tsugane