Hewlett-packard Development Company, L.p.

Innodisk Corporation

Ken Tsai

Chung-Liang Lee

Chanson Lin

Chienchih Chiu

Arthur Lin

Chiacheng Wei

In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.

Casings of electronic devices

An improved structure of USB compatible application apparatus is mainly provided a PCB circuit board to be a USB compatible application module of a connector. A top surface of the PCB carrying board is used to carry a plurality of connecting terminators. A board bottom sandwich is naturally formed between a bottom surface of the PCB carrying board and an covering shell of the connector. At least one electrical element are fixed inside of the board bottom thereby selectively reducing a length of a USB compatible application module or increasing working efficiency of the USB compatible application module. Further, at least one board top data transmission lines are set on part of the top surface of the PCB carrying board without setting the first connecting terminators thereby further raising working efficiency of the USB compatible application apparatus.

Structure of USB compatible application apparatus

Growing community of inventors

Taipei, Taiwan

Ken Tsai