Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Ken Takano

Minoru Yamamoto

Kunio Sakurai

Seiichi Mogi

Hirokazu Honkawa

Yuji Takahashi

Kazu Wagatsuma

Yoshihiko Misawa

Youichi Nakamura

Kazumasa Okumura

Kurayasu Hamasaki

Muneyoshi Fujiwara

Kentaro Nishiwaki

Akira Kabeshita

Takeshi Okada

Koichi Nagai

Tatsuo Sasaoka

Makito Seno

Kazumichi Shimizu

Yoichi Makino

Kenji Okamoto

Yoichiro Ueda

Satoru Kimura

Hiroshi Ota

Hideo Sakon

Masaru Ichihara

Daisuke Sato

An electronic device assembling apparatus has a cable holder and a lock member operator. The cable holder holds a cable and inserts the cable into a connector. After the cable is inserted into the connector by the cable holder, the lock member operator operates a lock member to lock the cable to the connector. The lock member operator starts an operation with respect to the lock member in a state where the cable inserted into the connector is held by the cable holder.

Electronic device assembling apparatus

An electronic equipment assembly apparatus installs a mounted portion of a cable onto a connector of electronic equipment, the cable including a belt-shaped cable main body portion in which the mounted portion is formed in one end portion, and a reinforcing plate bonded to the one end portion side on one surface of the cable main body portion. The electronic equipment assembly apparatus includes: a cable holding tool which nips and holds the reinforcing plate by a blade and a chuck block; and a robot portion which moves the cable holding tool.

Electronic equipment assembly apparatus and electronic equipment assembly method

There is provided an electronic equipment assembly apparatus including: a cable mounting mechanism which holds a cable and installs the cable onto a connector; a lock operation mechanism which operates a lock mechanism provided in the connector; a locked-state checker which checks a state of the lock mechanism of the connector; and a controller which controls the cable mounting mechanism and the lock operation mechanism.

The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Electronic device manufacturing apparatus and electronic device manufacturing method

A work device includes a base unit, a movable unit configured to have an end effector mounted thereto, linking mechanisms linking the base unit to the movable unit, actuators fixed to the base unit for driving the plurality of linking mechanisms, respectively, and a controller that moves the end effector by operating the actuators. A certain linking mechanism out of the plurality of linking mechanisms includes a joint. The controller includes a joint angle determination unit that determines whether or not a bending angle of the linking mechanism at the joint is within an operable range.

Work device

A plurality of film substrates () having a bare chip () mounted on one side or both sides are joined into a laminated state by joint portions () and are attached to a motherboard () through junction by a joint portion () at a location off the mounting areas of the bare chips (), thereby achieving a lower profile, higher lamination, and higher capacity.

Bare chip mounted structure and mounting method

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting component

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimensionL+SL. Specifically,L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Components placing apparatus

In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.

Component mounting control method

A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.

Component suction device, component mounting apparatus and component mounting method

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting components

A plurality of self-propelled system heads ( ) are made to independently travel along a closed-loop travel track ( ) in a manner that the heads do not interfere with each other by controlling respective drive devices ( ). Components ( ) from a component supply device ( ) are held by component holding members ( ) of the heads, and thereafter, the components held by the component holding members are mounted on boards ( ) positioned by board positioning devices ( ).

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Osaka, Japan

Ken Takano