Toyo Seikan Kaisha, Ltd.

Toyo Seikan Group Holdings, Ltd.

Ken Sotobayashi

Takayuki Kikuchi

Masayuki Mori

Takahiro Kurosawa

Kazuo Tanabe

Tabayuki Kikuchi

An RFID tag substrate on which an RFID tag that performs wireless communication with a reader/writer is disposed includes a substrate layer, and a functional layer laminated or stacked on the substrate layer. The functional layer includes a plurality of layers laminated together including a high-dielectric-constant layer having a predetermined dielectric constant, and a high-permeability layer having a predetermined permeability. A product of the predetermined dielectric constant and the predetermined permeability is not smaller than 250.

RFID tag substrate for metal component

The present invention provides an RFID tag substrate in which communication characteristics of an RFID tag do not vary by an influence of contents in a container, the communication characteristics of the RFID tag are not deteriorated even if a metal container is used, the communication characteristics of the RFID tag can be excellently maintained irrespective of a material or contents of a container, and the tag can be reduced in thickness/size, and which can use a general-purpose RFID tag as it is and is suitable for a microwave type RFID tag that uses a UHF band or a frequency band of, e.g., 2.45 GHz in particular. There is provided an RFID tag substrateon which an RFID tagthat performs wireless communication with a reader/writer is disposed, comprising: a substrate layer; and a functional layerformed of a high-dielectric-constant layerand a high-permeable layerhaving different characteristics, wherein the functional layer having predetermined relative dielectric constant and relative permeability is provided, and a product of the relative dielectric constant and the relative permeability is not smaller than 250.

An IC tag can be mounted without deteriorating appearance of a container, breakage or the like of the IC tag can be prevented and excellent wireless communication between a reader/writer becomes possible by eliminating influence of the metal container by ensuring a long communication distance to the reader/writer by allowing excellent communication properties to be exhibited even when an existing IC chip is used and mounting an insulated and sealed IC tag on a metallic cover having a low possibility of being brought into contact with other goods and equipment and being hidden by the adjacent metallic containers. The metallic cover is provided with an IC chip (), which has a pull-tab (), and an IC tag () for the IC chip () mounted on the tab (), an antenna for the IC tab () and a matching circuit () for matching impedances between the antenna and the IC chip.

Metallic cover having IC tag, and metallic container

A resin overcap with an IC tag used as an overcap being on a metal cap and having an IC tag so that the transmission and reception of signals will not be disturbed by the metal cap, comprising a top panel and a cylindrical side wall hanging down from the circumferential edge of the top panel and in which the metal cap is fitted, wherein a step or a protrusion is formed on an upper portion on the inner surface of the cylindrical side wall to prevent the upward motion of the metal cap fitted in the cylindrical side wall, and an IC tag provided with an IC chip is mounted on the top panel to maintain a predetermined distance D to a top plate of the metal cap fitted into the cylindrical side wall.

Resin overcap provided with IC tag

[Problem] To provide a resin overcap provided with an IC tag that can be used as an overcap being fitted onto a metal cap and having an IC tag that is so provided that the transmission and reception of signals will not be disturbed by the metal cap. [Means for Solution] A resin overcap used being fitted onto a metal cap, comprising a top panel and a cylindrical side wall hanging down from the circumferential edge of the top panel and in which the metal cap is fitted, wherein a step or a protrusion is formed on an upper portion on the inner surface of the cylindrical side wall to prevent the upward motion of the metal cap fitted in the cylindrical side wall, and an IC tag provided with an IC chip is mounted on the top panel in a manner of maintaining a predetermined distance D to a top plate of the metal cap fitted into the cylindrical side wall.

Growing community of inventors

Yokohama, Japan

Ken Sotobayashi