Sony Corporation

Nikon Corporation

Renesas Electronics Corporation

Samsung Electronics Co., Ltd.

Nec Electronics Corporation

Sony Semiconductor Solutions Corporation

Nixon Corporation

Ken Ozawa

Nobuyuki Matsuzawa

Masanori Iwasaki

Nozomi Kimura

Daisuke Hobara

Hiroyuki Kunishima

Eiji Otani

Yasutaka Nakashiba

Seiji Kobayashi

Tatsuya Usami

Yoshiaki Yamamoto

Keiji Sakamoto

Shuzo Sato

Kwang-soo Kim

Hideaki Mogi

Shinichi Watanuki

Masaru Wakabayashi

Masato Hamatani

Toshiharu Nakashima

Yoko Watanabe

Boontarika Thunnakart

Kazuharu Inoue

Kensaku Maeda

Yutaka Ooka

Taichi Natori

Yusuke Moriya

Akihiro Komatsu

Shigeru Hagiwara

Mitsunori Numata

Wook-rae Kim

Ji-hoon Kang

Akio Ishikawa

Yuko Yamaguchi

Sean Park

Myung-jun Lee

Gwang-sik Park

An inspection device includes an objective lens that transmits inspection light reflected from a sample during inspection and measurement light from a point light source during aberration measurement, a first pupil relay lens that transmits the inspection light and the measurement light, a second pupil relay lens in which an intermediate imaging plane is formed between the second pupil relay lens and the first pupil relay lens, a diffraction grating disposed between the first pupil relay lens and the intermediate imaging plane and that diffracts the measurement light, a point diffraction interferometry plate disposed within a depth of focus of the intermediate imaging plane and that selectively transmits the diffracted light, a first detector that detects an image of the sample, and a second detector that detects a fringe image of the measurement light.

Inspection device and method of measuring wavefront aberration

An imaging device and method are provided. Light from an object is provided as a plurality of sets of light beams to a phase difference array having a plurality of elements. The phase difference array is configured to provide different optical paths for light included within at least some of a plurality of sets of light beams. The light from the phase difference array is received at an imaging element array. The imaging element array includes a plurality of imaging elements. Information obtained from hyperspectral imaging data based on output signals of the imaging element array can be displayed.

Imaging device and method

An imaging element includes a plurality of photoelectric conversion sections. The photoelectric conversion sections are arrayed on a substrate to receive light incident through a dual-pass filter that has transmission bands for visible light and a predetermined range of near-infrared light. The photoelectric conversion sections include a visible light photoelectric conversion section and a near-infrared light photoelectric conversion section. The visible light photoelectric conversion section includes a red light photoelectric conversion section, a green light photoelectric conversion section, and a blue light photoelectric conversion section.

Imaging element and camera system

Systems and methods related to a structured illumination (SI)-based inspection apparatus are described. The SI-based inspection apparatus may be capable of accurately inspecting an inspection object in real time with high resolution, while reducing the loss of light. Also described are an inspection method, and a semiconductor device fabrication method including the SI-based inspection method. The inspection apparatus may include a light source configured to generate and output a light beam, a phase shifting grating (PSG) configured to convert the light beam from the light source into the SI, a beam splitter configured to cause the SI to be incident on an inspection object and output a reflected beam from the inspection object, a stage capable of moving the inspection object and on which the inspection object is arranged, and a time-delayed integration (TDI) camera configured to capture images of the inspection object by detecting the reflected beam.

Structured illumination-based inspection apparatus and inspection method, and semiconductor device fabrication method including structured illumination-based inspection method

An imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element includes a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.

Imaging apparatus and camera system with optical member

An imaging apparatus includes an illumination light source to output an illumination light, an illumination optical system to transmit the illumination light toward a sample, an imaging optical system to transmit light reflected from the sample, a stage to move the sample in a predetermined transfer direction, and a photographing unit to receive the reflected light. The imaging apparatus may include one or more diffraction grids located at conjugate focal planes of the sample. The operation of the photographing unit may be synchronized with a movement of the sample by the stage to obtain an image in accordance with a time delay integration method.

Imaging apparatus and imaging method

Disclosed is an optical semiconductor device which can be improved in light shift precision and restrained from undergoing a loss in light transmission. In this device, an inner side-surface of a first optical coupling portion of an optical coupling region and an inner side-surface of a second optical coupling portion of the region are increased in line edge roughness. This manner makes light coupling ease from a first to second optical waveguide. By contrast, the following are decreased in line edge roughness: an outer side-surface of the first optical coupling portion of the optical coupling region; an outer side-surface of the second optical coupling portion of the region; two opposed side-surfaces of a portion of the first optical waveguide, the portion being any portion other than the region; and two opposed side-surfaces of a portion of the second optical waveguide, the portion being any portion other than the region.

Optical semiconductor device, and method for producing the same

Imaging apparatus and camera system for improving image quality

Imaging apparatus and camera system

A stereoscopic imaging method where a pixel matrix is divided into groups such that parallax information is received by one pixel group and original information is received by another pixel group. The parallax information may, specifically, be based on polarized information received by subgroups of the one pixel, group and by processing all of the information received multiple images are rendered by the method.

Stereoscopic imaging method and system that divides a pixel matrix into subgroups

The present technique relates to a display control device, a method, and a program that can improve user's operability of a free-cursor type user interface. An imaging unit outputs an RGB image based on a pixel signal corresponding to a visible light among light input through a lens and an IR image based on a pixel signal corresponding to an infrared light among light input through the lens. An ROI set unit sets a movement area of an infrared light source in the IR image based on the RGB image, and a display control unit controls a cursor movement amount on a display unit according to movement of the infrared light source in the movement area. The present technique can be applied to a television set that monitors a viewing condition of a viewer, for example.

Display control device, method, and program

Imaging apparatus and camera system with light-transmitting laminated material

An image-capturing device includes an image-capturing unitincluding a first image-capturing element, a second image-capturing element, a third image-capturing element, and a fourth image-capturing element, and includes an image processing unit, wherein a sensitivity of the fourth image-capturing elementis less than sensitivities of the first image-capturing elementto the third image-capturing element, and the image processing unitgenerates high sensitivity image data on the basis of outputs from the first image-capturing elementto the third image-capturing element, and generates low sensitivity image data on the basis of an output from the fourth image-capturing element, and further, the image processing unitgenerates a combined image using high sensitivity image data corresponding to a low illumination image area in the low illumination image area obtained from the low sensitivity image data or the high sensitivity image data, and using low sensitivity image data corresponding to an high illumination image area.

Image-capturing device

A chemical sensor including a substrate, an on-chip lens layer, and a flattening layer. On the substrate, a plurality of photodiodes are formed and arranged in a planar form. The on-chip lens layer collects incident light to the photodiodes and is provided on the substrate. The flattening layer covers and planarizes the on-chip lens to form a probe holding surface for holding a probe material.

Chemical sensor, chemical sensor module, biomolecule detection apparatus, and biomolecule detection method

Growing community of inventors

Kanagawa, Japan

Ken Ozawa