Ulvac, Inc.

Other

Tohoku University

Nihon Shinku Gijutsu Kabushiki Kaisha

Toto Ltd.

Ken Maehira

Koh Fuwa

Yoichi Haga

Tadao Matsunaga

Tetsuo Kitabayashi

Tetsuhiro Ohno

Taichi Suzuki

Noriaki Tateno

Hiroaki Hori

Kou Fuwa

Takeshi Uchimura

Yasutomo Ohashi

Tomoko Kittaka

Hirotoshi Sakaue

Katsuhiro Fujita

A first voltage is applied to a first positive electrode and a first negative electrode of an attraction plate in a lying posture to attract a dielectric object to be attracted on the attraction plate. The attraction plate is turned to a stand posture while attracting the dielectric object by a gradient force, and a conductive thin film is grown while applying a second voltage to a second positive electrode and a second negative electrode to generate an electrostatic force. Since the object is continuously attracted, the attraction plate will not detach. After having started attraction by electrostatic force, introduction of heat medium gas between the object and the attraction plate allows for temperature control of the object.

Conductive thin film manufacturing method

Providing a technique for suppressing dust generation at the time of attraction and detachment of an object to be attracted, and for enabling control the attraction force of the attraction device to be uniform. The attraction device of the present invention includes a main body part having attraction electrodes within a dielectric; and an attraction part for attracting a substrate, provided on a surface of the main body part at an attraction-side. The attraction part includes a contact support part that is in contact with, and supports the substrate and a non-contact part that is not in contact with the substrate. In the attraction part, the volume resistivity of the material of the contact support part is greater than the volume resistivity of the material of the non-contact part.

Attraction device, method for producing attraction device, and vacuum processing device

A ultrasound probe according to this invention is provided with: a first dry film resist having a plurality of first apertures formed in an array shape, and respectively supporting the piezoelectric elements in close contact with a rim part of each of the first apertures in a state of partly exposing the function elements; a second dry film resist laminated on the first dry film resist, and also having second apertures respectively enclosing each of the function elements, the second dry film resist being of a thickness equivalent to that of each of the function elements; and a third dry film resist laminated on the second dry film resist, and also having third apertures, and respectively sandwiching each of the piezoelectric elements with the first dry film resist in a state of partly exposing the piezoelectric elements in close contact with a rim part of each of the third apertures.

Device, method of manufacturing the device, and method of manufacturing array type of ultrasound probe

A chuck equipment which can hold insulating substrates is provided. First and second electrodes are provided to be exposed on the base the surface of which is insulated. The insulating substrate is placed in contact with or in close proximity to the surfaces of the first and second electrodes. Since an electric field having a high rate of spatial change is established between the first and second electrodes, the substrate is held against the surface of the chuck equipment by the gradient force. Since the magnitude of the gradient force depends on that of the rate of change of the electric field, a voltage may be applied between the first and second electrodes to establish an electric field of 1.0&times;10 V/m or greater.

Chuck equipment

According to the present invention, there is provided an electrostatic chuck for electrostatically attracting an insulative substrate, an apparatus for heating/cooling an insulative substrate using the electrostatic chuck, and a method for controlling the temperature of an insulative substrate. The shape and the properties of the dielectric, and the shape of the electrodes, which form the electrostatic chuck, are disclosed. Also the apparatus for heating/cooling an insulative substrate comprising a plate, a gas supply conduit and a temperature controlling system, and the apparatus for processing an insulative substrate in which the apparatus for heating/cooling an insulative substrate is installed are disclosed.

Electrostatic chuck and processing apparatus for insulative substrate

Growing community of inventors

Kanagawa, Japan

Ken Maehira