Marvell International Limited

Ken Liao

Qiang Tang

Min She

An integrated circuit includes a substrate. The substrate includes diffusion lines. The diffusion lines include impurities diffused into the substrate. A signal line layer includes first signal lines. A first metal layer includes second signal lines. The second signal lines include a first metallic material. A second metal layer includes third signal lines. The third signal lines include a second metallic material. First contacts connect the diffusion lines to (i) a first set of the second signal lines, or (ii) a first set of the third signal lines. Second contacts connect a first set of the first signal lines to a second set of the third signal lines. Each signal line in a first set of the second signal lines includes first portions and second portions. The first portions extend towards and are not connected to the second contacts. The first portions are not parallel to the second portions.

Method and apparatus for connecting signal lines of multiple layers to certain contacts while preventing connections with other contacts

A memory array includes a first layer, a second layer, a third layer and a contact. The first layer is disposed on a substrate. The second layer includes a first conductive line. The first conductive line includes first line segments and second line segments. Each of the second line segments are connected to a respective one of the first line segments. The first line segments extend in a first direction on the first layer. The second line segments extend in a second direction on the first layer. The first direction is different than the second direction. The third layer is disposed on the second layer. The contact is disposed through the second layer and connects the third layer to the first conductive line. One of the first line segments extends towards the contact. Each of the first and second line segments are at least a predetermined distance from the contact.

Memory and interconnect design in fine pitch

A memory array including a diffusion layer, a poly layer, a metal one layer, a metal two layer, and a contact. The diffusion layer comprises diffusion lines extending in a first direction. The poly layer comprises poly lines extending in the first direction and being arranged on top of and insulated from the diffusion layer. The metal one layer comprises metal one lines extending in the first direction and being arranged on top of and insulated from the poly layer. The metal two layer comprises a metal two line extending in the first direction and being arranged on top of and insulated from the metal one layer. The contact extends through the poly layer, and connects a metal one line to a diffusion line. A poly line further extends in a second direction to bend around the contact such that a predetermined distance separates the poly lines from the contact.

An integrated circuit includes a plurality of signal lines. A first signal line layer includes a plurality of first signal lines. A second signal line layer includes a plurality of second signal lines arranged on top of and insulated from the first signal line layer. A third signal line layer includes a plurality of third signal lines arranged on top of and insulated from the second signal line layer. A contact extends through the second signal line layer and connects at least one of the plurality of third signal lines to at least one of the first signal lines. At least one of the second signal lines further extends in a second direction to bend around the contact such that a predetermined distance separates the plurality of second signal lines from the contact.

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Santa Clara, CA, United States of America

Ken Liao