Crystal Is, Inc.

Sony Olympus Medical Solutions Inc.

Meet Co., Ltd.

Ken Kitamura

Jianfeng Chen

Masato Toita

Yuting Wang

Hironori Ishii

Leo J Schowalter

James R Grandusky

Yuxin Li

Satoshi Yamada

Craig Moe

Amy Wilson Miller

Radio frequency identification tag

In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.

Methods and packages for enhancing reliability of ultraviolet light-emitting devices

In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.

Photon extraction from ultraviolet light-emitting devices

A storage case includes: a casing having an opening bottom and configured to internally store a functional unit electrically connected to perform a function; a power supply configured to supply power to the functional unit; a drive module including a drive board arranged on an upper surface or side surface of the casing and configured to drive the functional unit; a connector configured to electrically connect the power supply and the drive module; and a restriction member configured to restrict movement of the casing, wherein the drive board is arranged on a surface in a removal direction of the casing, and a connection/disconnection direction of the connector is different from the removal direction of the casing.

Storage case

In various embodiments, an electrochemical process is utilized to remove at least a portion of a substrate from multiple singulated or unsingulated electronic-device or optoelectronic-device dies. The dies may be attached to a submount for the removal process, and the dies may be immersed in or non-immersively contact an electrolyte during the removal process.

Electrochemical removal of aluminum nitride substrates for electronic and optoelectronic devices

In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.

Ultraviolet light-emitting devices and methods

In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant and having a rigid lens. Downward forces is applied while the encapsulant is at least partially cured to substantially prevent partial or full detachment of the rigid lens from the light-emitting device, and/or substantially suppress formation of bubbles between the light-emitting device and the rigid lens.

Growing community of inventors

Tokyo, Japan

Ken Kitamura