Enplas Corporation

Ken Kitamoto

Koichi A Ono

Ryoya Nakamura

A manufacturing method capable of manufacturing a laminate including a substrate having a recess and a film with a high yield is provided. The method of manufacturing a laminate of the present invention includes: preparing a substrate having a recess; disposing a film on the substrate so as to cover the recess; and obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on the first elastic body side, in which the first elastic body is harder than the second elastic body.

Method of manufacturing laminate

This detection device is provided with: a chip including a detection region for detecting a substance to be detected; a light source which emits excitation light; a detector for detecting the fluorescence emitted from a fluorescent substance which labels the substance to be detected, and which is excited by the excitation light; and an optical fiber which includes a core, and a cladding covering the outer peripheral surface of the core, guides, to the detection region, the excitation light emitted from the light source, and guides, to the detector, the fluorescence emitted from the fluorescent substance. The optical fiber is fixed to the chip directly or via a connector. The excitation light emitted from the light source is guided within the core, and reaches the detection region of the chip. The fluorescence emitted from the fluorescent substance is guided within the core and the cladding, and reaches the detector.

Optical fiber fluorescence detection device

A liquid handling device has an accommodation part for accommodating a liquid, two or more flow paths each opening to a lower part of a side wall surface of the accommodation part, and a liquid movement suppression part that is disposed in the lower part of the side wall between the openings of two of the flow paths that are adjacent to each other and slows or stops the movement of the liquid along the corner formed by the lower surface of the accommodation part and the side wall surface.

Liquid handling device

This liquid handling device is provided with a first chip that comprises a first substrate, a first film, a first flow path, a second flow path and a partition wall. A diaphragm portion of the first film is over the first flow path, the second flow path and the partition wall, and the center thereof is arranged over the first flow path. The first chip comprises a discharge hole or a discharge flow path which, in the liquid flow direction in the first flow path, opens into the first flow path between the partition wall and the center of the diaphragm and allows communication between the inside and outside of the first flow path.

A fluid handling device includes a substrate, a film and a conductive layer. The substrate includes a through hole or a recess. The film includes first, second and third regions. The conductive layer is disposed on one surface of the film across the first, second and third regions. The first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part, and that a part of the conductive layer is exposed to the inside of the housing part. The second region of the film is bent such that the conductive layer is located on an outside. The third region of the film is bonded to the first region of the film such that the conductive layer is exposed to the exterior.

Fluid handling device

A fluid handling device includes a substrate, a film, and a conductive layer. The substrate includes a first through-hole, and a second through-hole. The conductive layer is disposed on one surface of the film to extend in a first area, a second area and a third area of the film. The substrate includes a first surface and a second surface facing away from the first surface. The first area is bonded to the first surface of the substrate such that a housing part is formed by closing one opening of the first through-hole, and such that a part of the conductive layer is exposed to the inside of the housing part. The second area is disposed inside the second through-hole, and the third area is bonded to the second surface of the substrate such that a part of the conductive layer is exposed to the outside.

A micro fluid chip includes a first chip and a second chip. The first chip includes a first substrate having a fluid channel and a partition wall, and a first film made of resin. The second chip includes a second substrate having a recess, and a second film made of elastomer. The second film has an elastic modulus higher than that of the first film. The first chip and the second chip are stacked in such a manner that the partition wall and the recess face each other with the first film and the second film therebetween. By setting the inner side of the recess to a negative pressure, a gap is formed between the first film and the partition wall, and thus a fluid channel is opened.

Fluid handling device and fluid handling method

A liquid handling apparatus includes a substrate that includes a groove which is a channel through which a liquid can be moved on the basis of a capillary phenomenon, and a film that is bonded to the substrate to cover the opening of the groove, in which the channel has a main channel and a guide channel, the groove has a main groove that is the main channel by the film being bonded to the substrate, and a guide groove that is the guide channel by the film being bonded to the substrate, opens on a lateral surface of the main groove, and has a width narrower than the width of the main groove, and the guide groove is placed in an area on a film side of the lateral surface of the main groove and shallower than the main groove.

Liquid handling apparatus

Chip bodyin which a through hole or concave is formed, intermediate film, on one surface of which adhesive layer' is formed and lower film, on one surface of which transfer function layeris formed, are prepared. Intermediate filmand lower filmare bonded together such that transfer function layeris embedded in adhesive layer&#x2032; to form a laminated body. The laminated body and chip bodyare bonded together by thermocompression to manufacture micro-chip

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Saitama, Japan

Ken Kitamoto