Dowa Mining Co., Ltd.

Dowa Metaltech Co., Ltd.

Ken Iyoda

Hideyo Osanai

Makoto Namioka

Susumu Shimada

Susumu Ibaraki

The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plateis bonded on a part of a ceramic substrateso as to expose an outer peripheral edge portion of the ceramic substratein an integrally bonded member, the integrally bonded memberis set on a treating apparatuswhile being covered with a masking memberhaving a window portionfrom which the circuit pattern forming metal plateof the integrally bonded memberis exposed. Further, the integrally bonded memberis pressed with an appropriate pressure from a base plateside so that a boundary surface between a portionsurrounding the window portion in the masking member and an exposed surfaceof the ceramic substrate which is exposed in a metal-ceramic bonded memberhas a state not allowing a liquid to pass therethrough. Thereafter, a treatment solutionfor wet treatment is injected from an injection pipeto be in contact with the circuit pattern forming metal plate

Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plateis bonded to one side of a ceramic substrate, and a heat sink plate (metal base plate)is bonded to the other side thereof. On the heat sink plate, a work-hardened layeris formed by shot peening. On the metal circuit plateof the metal/ceramic bonding substrate, semiconductor chips (Si chips)are soldered (solder layer). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer) of the power module, a radiating finis mounted via a thermal greaseby means of screwsor the like.

Metal/ceramic bonding substrate and method for producing same

The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.

Combined member of aluminum-ceramics

The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2&tilde;5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Growing community of inventors

Tokyo, Japan

Ken Iyoda