Sumitomo Mitsubishi Silicon Corporation

Sumco Corporation

Kashiwara Machine Mfg. Co., Ltd.

Ken Isobe

Akira Horiguchi

Hiroshi Matsumoto

Yoshiaki Uzu

Heigo Tanaka

Tomio Fukushima

Kiyohide Murata

Hiroto Fukushima

Tomonori Miura

Shoji Nakao

Tsuneo Takeda

Tsunco Takeda

To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole.

Polishing method and polishing apparatus

To provide a technique for rotating a plurality of carriersbetween an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works. The workis merged with the carrieroutside a polishing apparatus main body. The workis supplied onto a lower rotary surface plateof the polishing apparatus main bodywhile remaining merged with the carrier. The present invention enables the workon the lower rotary surface plateto be perfectly automatically supplied. After double side polishing has been completed and when an upper rotary surface plate, a liquid such as a water is injected from the upper rotary surface plate to hold the plurality of worksto have both surfaces thereof polished, on the lower rotary surface plate. The present invention enables the worksto be automatically ejected from the lower rotary surface plate. A brush housing sectionand a dresser housing sectionare provided near the polishing apparatus main body. Brushes and dressers are used to frequently efficiently process polishing clothes installed on opposite surfaces of the upper and lower rotary surface plates to efficiently and economically achieve high-quality double side polishing.

Double side polishing method and apparatus

A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works () integrally with the carriers () on the outside of a polishing device main body (), feeding the works () onto a rotating surface plate () on the underside of the polishing device main body () with the works formed integrally with the carriers (), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works () on the lower side rotating surface plate () after the double sides are polished, enabling the works () to be discharged automatically from the lower side rotating surface plate (), providing a brush storage part () and a dresser storage part () near the polishing device main body (), and frequently treating a polishing cloth installed on the opposed surfaces of the upper and lower rotating surface plates with a brush and a dresser.

Growing community of inventors

Shijyonawate, Japan

Ken Isobe