Mitsui Minings & Melting Co., Ltd.

Ken-ichiro Iwakiri

Makoto Dobashi

Junshi Yoshioka

Akiko Sugimoto

Yutaka Hirasawa

Takuya Yamamoto

Tsutomu Higuchi

Sakiko Taenaka

The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Electolytic copper foil with carrier foil and method for manufacturing the same

To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil

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Ageo, Japan

Ken-ichiro Iwakiri