Adeka Corporation

Josho Gakuen Educational Foundation

The Kansai Electric Power Co., Inc.

Tokyo Medical and Dental University

Sapporo Medical University

Adeka Coporation

Km Biologics Co., Ltd.

Ken-ichiro Hiwatari

Yoshikazu Shoji

Shinji Sakuma

Yoshitaka Sugawara

Takashi Sueyoshi

Kyohei Ochiai

Tadashi Janado

Kohta Mohri

Seiichi Saito

Akio Kishida

Tsuyoshi Kimura

Takanori Uchida

Tomoaki Saiki

Tetsuya Higami

Akiko Tasaki

Yu Yamaguchi

Seiichi Funamoto

Jun Negishi

Haruki Obara

Isamu Yumoto

Takuya Kimura

Shoko Tokorozaki

Shinji Yamashita

Hideki Saga

Junichi Matsuda

Sumika Miyabashira

Satomi Harano

An anti-adhesion material comprising decellularized tissues and a biocompatible polymer or fibrin glue; a method for preparing an anti-adhesion material comprising complexing a biocompatible polymer or fibrin glue to decellularized tissues; an anti-adhesion material kit comprising decellularized tissues and a biocompatible polymer or fibrin glue; a substitute biomembrane comprising decellularized tissues and a biocompatible polymer or fibrin glue; a method for preparing a substitute biomembrane comprising complexing a biocompatible polymer or fibrin glue to decellularized tissues; and a substitute biomembrane kit comprising decellularized tissues and a biocompatible polymer or fibrin glue.

Anti-adhesion material and substitute biomembrane using decellularized tissue

A polysaccharide derivative has a partial structure represented by Formula (1) below. It is preferable that at least one of the amino acids that constitute Xin Formula (1) below is a basic amino acid. 

Polysaccharide derivative having membrane-permeable peptide chain

A polymer compound has a group represented by Formula (1) or Formula (2) in a side chain. (In Formula (1), Xrepresents a neutral amino acid residue or an &#x3c9;-aminoalkanoic acid residue, Xrepresents a membrane-permeable peptide residue, Xrepresents a hydroxyl group, an amino group, an alkoxyl group having 1 to 4 carbon atoms, or a benzyloxy group, and a represents a number of from 1 to 50.) (In Formula (2), Xrepresents a neutral amino acid residue or an &#x3c9;-aminoalkanoic acid residue, Xrepresents a membrane-permeable peptide residue, Xrepresents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a benzyl group, an acyl group having 1 to 6 carbon atoms, an arylsulfonyl group, or a carboxyl group, and b represents a number of from 1 to 50.).

Polymer compound which has membrane-permeable peptide in side chain

A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), Rto Reach represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and Xrepresents a group represented by the formula (2) or (3). In formula (2), Rrepresents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, Lrepresents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), Rrepresents a C1-4 alkyl group or a C6-12 aryl group, Xrepresents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, Lrepresents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of Xs is the group represented by the formula (2).

Compound having hindered amine backbone, and resin composition

A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 &#x3bc;m, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.

Diagnostic marker

Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.

Curable composition for semiconductor encapsulation

A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), R-R=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Rand Rdo not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Silicon-containing compound, curable composition and cured product

A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A' and one or more Si&#x2014;O&#x2014;Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si&#x2014;H group and one or more Si&#x2014;O&#x2014;Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A&#x2032;, an Si&#x2014;H group, and one or more Si&#x2014;O&#x2014;Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A&#x2032; is any of Si&#x2014;R, Si&#x2014;O&#x2014;R, and Si&#x2014;R&#x2014;OCOC(R)&#x2550;CH, provided that Rand Reach is alkenyl, Ris alkylene and/or arylene, and Ris hydrogen or methyl.

Silicon-containing curing composition and heat cured product thereof

Growing community of inventors

Tokyo, Japan

Ken-ichiro Hiwatari