Adeka Corporation

Ken-ichi Tamaso

Ryo Ogawa

Takeshi Endo

Kozo Matsumoto

Chihiro Asakura

Tamotsu Nagamatsu

Shota Kobayashi

Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

Curable resin composition

An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, Rto Reach independently indicate a hydrogen atom, an alkyl group or an aryl group, Rindicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or &#x2014;NR&#x2014;, and Rindicates a hydrogen atom, an alkyl group or an aryl group.

Epoxy resin composition

The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; Rand Rindependently represent a hydrogen atom, an alkyl group or an aryl group; Rrepresents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or &#x2014;NR&#x2014;; and Rrepresents a hydrogen atom, an alkyl group or an aryl group.)

Phosphorus-containing compound, and curable epoxy resin composition containing same

A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, Rand Reach independently express an alkyl group or an aryl group, Rexpresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or &#x2014;NR&#x2014;, and in this regard, Rexpresses a hydrogen atom, an alkyl group or an aryl group.

Flame-retardant epoxy resin composition, prepreg and laminated plate using the same

Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R, R, R, and Rare each hydrogen, alkyl, or aryl; Ris alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or &#x2550;NR'; and R&#x2032; is hydrogen, alkyl, or aryl.

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Saitama, Japan

Ken-ichi Tamaso