Hitachi, Ltd.

Ken'ichi Okada

Hiroshi Hasegawa

Ryoji Iwamura

Masahiro Takagi

An apparatus for producing a multilayer ceramic board having uniform density over the total area of the green sheets after a thermal compression bonding comprises a lower mold in which a plurality of green sheets, having conductive wiring patterns printed thereon, are to be set in a stacked state, an upper mold which comes into contact with a top surface of the uppermost sheet of the plurality of green sheets and applies a pressing load on the stacked green sheets toward the lower mold, and a restraining mold which restraining the plurality of green sheets in the stacked state therein and having an inner wall surface in contact with peripheral wall portions of the upper and lower molds, the confining mold being movably supported in a direction of the pressing load of the upper mold.

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Yokohama, Japan

Ken'ichi Okada