Mitsubishi Rayon Company, Limited

Nitto Chemical Industry Co., Ltd.

Diafloc Co., Ltd.

Ken-ichi Inukai

Kenji Kushi

Takayuki Iseki

Seiya Koyanagi

Yasuyuki Fujimoto

Isao Sasaki

Teruhiko Sugimori

Hideaki Habara

Akihisa Furuno

A photopolymerizable or radiation polymerizable alkaline developing crosslinking curable resin composition possessing superior antiplating properties and a short stripping period, in which the stripped plate is not easily dissolved in the stripping fluid, and which is comprising:

Crosslinking curable resin composition

A flame-resistant, photo-curing resin composition of the present invention consists of:

Flame-resistant photo-curable resin composition

A photopolymerizing cross-linking hardenable resin composition is disclosed which is comprised of a binder resin, cross-linking monomer and photopolymerization initiator. The composition of each of the above mentioned components is such that dry film resist incorporating the resin composition of the present invention and used in processes for selective etching and plating of printed circuit boards can be developed in weak aqueous alkaline solution after selective exposure to light. In this way, the efficient and economical manufacture of high definition printed circuit boards is made possible. Additionally, dry film resist incorporating the photopolymerizing cross-linking hardenable resin composition of the present invention lends to easy handling and storage characteristics.

Cross-linking hardenable resin composition, metal laminates thereof and

A crosslinking-curable resin composition suitable for use in dry film resists, consisting essentially of

Crosslinking-curable resin composition

Disclosed is a flame-retardant liquid photosensitive resin composition consisting essentially of

Flame-retardant liquid photosensitive resin composition

Disclosed is a liquid photosensitive resin composition comprising

Liquid photosensitive resin composition containing carboxylated epoxy

The invention relates to a process for producing a powder of a cationic polymer by spreading on a moveable carrier a layer of an aqueous solution of a vinyl monomer, carrying out continuous polymerization followed by peeling off hydrous polymer from the carrier in a hot state, and cutting said hydrous polymer in a hot state by a shearing stress.

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Otake, Japan

Ken-ichi Inukai