Taiwan Semiconductor Manufacturing Comp. Ltd.

Ken-Ichi Goto

Zhiqiang Wu

Tsung-Hsing Yu

Chia-Wen Liu

Wei-Hao Wu

Yi-Ming Sheu

Shih-Syuan Huang

Yu-Ming Lin

Carlos H Diaz

Wen-Hsing Hsieh

Jon-Hsu Ho

Chih-Ching Wang

Ching-Fang Huang

Dhanyakumar Mahaveer Sathaiya

Chung-Te Lin

Jean-Pierre Colinge

Mauricio Manfrini

Kai-Chieh Yang

Krishna Kumar Bhuwalka

Yeh Hsu

Tzer-Min Shen

Yuan-Chen Sun

Shau-Lin Shue

Tai-I Yang

Hsin-Ping Chen

Chih-Hao Wang

Yee-Chia Yeo

Ta-Pen Guo

Wen-Chin Lee

Chun-Chieh Lu

Chung-Cheng Wu

Cheng-Yi Wu

Hui-Hsien Wei

Pin-Cheng Hsu

Shyh-Horng Yang

Yen-Chung Ho

Chia-Jung Yu

Yong-Jie Wu

Wen-Yuan Chen

Huan-Tsung Huang

Ching-Ya Wang

Yuri Masuoka

Mahaveer Sathaiya Dhanyakumar

Sai-Hooi Yeong

Chih Chieh Yeh

Katherine H Chiang

Chih-Yu Chang

Han-Ting Tsai

Chih-Chieh Yeh

Yen-Chieh Huang

Neil Quinn Murray

Min-Kun Dai

Chia Yu Ling

Ching-Chang Wu

Meikei Ieong

A semiconductor device includes a substrate, and a first transistor disposed on the substrate. The first transistor includes a first channel layer, a magnesium oxide layer, a first gate electrode, a first gate dielectric and first source/drain electrodes. A crystal orientation of the first channel layer is <100> or <110>. The magnesium oxide layer is located below the first channel layer and in contact with the first channel layer. The first gate electrode is located over the first channel layer. The first gate dielectric is located in between the first channel layer and the first gate electrode. The first source/drain electrodes are disposed on the first channel layer.

Semiconductor device and method of fabricating the same

A semiconductor device including a substrate, a first layer over the substrate, and a second layer over the first layer. The first layer including a first fin structure, a first gate structure that overlaps the first fin structure to form a first pass-gate transistor, and a second gate structure that is separate from the first gate structure and that overlaps the first fin structure to form a first pull-down transistor. The second layer including a third gate structure disposed over the second gate structure and connected to the second gate structure, a first semiconductor oxide structure disposed on the third gate structure, and a first drain/source region and a second drain/source region disposed on the first semiconductor oxide structure, wherein the third gate structure, the first semiconductor oxide structure, the first drain/source region, and the second drain/source region constitute a first pull-up transistor.

Memory devices including transistors on multiple layers

A memory device and method of making the same, the memory device including bit lines disposed on a substrate; memory cells disposed on the bit lines; a first dielectric layer disposed on the substrate, surrounding the bit lines and the memory cells; a second dielectric layer disposed on the first dielectric layer; thin film transistors (TFTs) embedded in the second dielectric layer and configured to selectively provide electric power to corresponding memory cells, the TFTs comprising drain lines disposed on the memory cells, source lines disposed on the first dielectric layer, and selector layers electrically connected to the source lines and the drain lines; and word lines disposed on the second dielectric layer and electrically connected to the TFTs.

High-density memory device with planar thin film transistor (TFT) selector and methods for making the same

The present disclosure, in some embodiments, relates to a memory device. In some embodiments, the memory device comprises a substrate and a lower interconnect metal layer disposed over the substrate. A selecting transistor is disposed over the lower interconnect metal layer. A memory cell is disposed over the selecting transistor and comprises a bottom electrode electrically connected to the selecting transistor, a data storage structure disposed over the bottom electrode, and a top electrode disposed over the data storage structure.

Spacer-defined back-end transistor as memory selector

A method of characterizing a wide-bandgap semiconductor material is provided. A substrate is provided, which includes a layer stack of a conductive material layer, a dielectric material layer, and a wide-bandgap semiconductor material layer. A mercury probe is disposed on a top surface of the wide-bandgap semiconductor material layer. Alternating-current (AC) capacitance of the layer stack is determined as a function of a variable direct-current (DC) bias voltage across the conductive material layer and the wide-bandgap semiconductor material layer. A material property of the wide-bandgap semiconductor material layer is extracted from a profile of the AC capacitance as a function of the DC bias voltage.

Wide-bandgap semiconductor layer characterization

A method of fabricating a device on a substrate includes doping a channel region of the device with dopants. The method further includes growing an undoped epitaxial layer over the channel region, wherein growing the undoped epitaxial layer comprises deactivating dopants in the channel region to form a deactivated region. The method further includes forming a gate structure over the deactivated region.

Method of dopant deactivation underneath gate

A first thin film transistor and a second thin film transistor include a semiconducting metal oxide plate located over a substrate, and a set of electrode structures located on the semiconducting metal oxide plate and comprising, from one side to another, a first source electrode, a first gate electrode, a drain electrode, a second gate electrode, and a second source electrode. A bit line is electrically connected to the drain electrode, and laterally extends along a horizontal direction. A first capacitor structure includes a first conductive node that is electrically connected to the first source electrode. A second capacitor structure includes a second conductive node that is electrically connected to the second source electrode.

Drain sharing for memory cell thin film access transistors and methods for forming the same

A memory device and method of making the same, the memory device including bit lines disposed on the substrate; memory cells disposed on the bit lines; a first dielectric layer disposed on the substrate, surrounding the bit lines and the memory cells; a second dielectric layer disposed on the first dielectric layer; thin film transistors (TFTs) embedded in the second dielectric layer and configured to selectively provide electric power to corresponding memory cells, the TFTs comprising drain lines disposed on the memory cells, source lines disposed on the first dielectric layer, and selector layers electrically connected to the source lines and the drain lines; and word lines disposed on the second dielectric layer and electrically connected to the TFTs.

A semiconductor device includes a semiconductor substrate and an interconnection region disposed on the semiconductor substrate. The interconnection region includes stacked metallization levels, a magnetic tunnel junction, and a transistor. The magnetic tunnel junction is formed on a first conductive pattern of a first metallization level of the stacked metallization levels. The transistor is formed on a second conductive pattern of a second metallization level of the stacked metallization levels. The transistor is a vertical gate-all-around transistor. A drain contact of the transistor is electrically connected to the magnetic tunnel junction by the first conductive pattern of the first metallization level. The second metallization level is closer to the semiconductor substrate than the first metallization level.

Semiconductor device and manufacturing method thereof

The present disclosure, in some embodiments, relates to a memory device. In some embodiments, the memory device comprises a substrate and an interconnect structure disposed over the substrate. The interconnect structure comprises stacked interconnect metal layers disposed within stacked interlayer dielectric (ILD) layers. A memory cell is disposed between an upper interconnect metal layer and an intermediate interconnect metal layer. A selecting transistor is connected to the memory cell and disposed between the intermediate interconnect metal layer and a lower interconnect metal layer. By placing the selecting transistor within the back-end interconnect structure between two interconnect metal layers, front-end space is saved, and more integration flexibility is provided.

A NEMS device structure and a method for forming the same are provided. The NEMS device structure includes a first dielectric layer formed over a substrate, and a first conductive layer formed in the first dielectric layer. The NEMS device structure includes a second dielectric layer formed over the first dielectric layer, and a first supporting electrode a second supporting electrode and a beam structure formed in the second dielectric layer. The beam structure is formed between the first supporting electrode and the second supporting electrode, and the beam structure has a T-shaped structure. The NEMS device structure includes a first through hole formed between the first supporting electrode and the beam structure, and a second through hole formed between the second supporting electrode and the beam structure.

Nano-electromechanical system (NEMS) device structure and method for forming the same

A semiconductor device includes a channel region comprising dopants, a gate structure over the channel region and a deactivated region underneath the gate structure and partially within the channel region. Dopants within the deactivated region are deactivated. The deactivated region includes carbon. The deactivated region is physically separated from a top surface of a substrate by a portion of the substrate that is free of carbon.

MOSFET with selective dopant deactivation underneath gate

In a method of manufacturing a gate-all-around field effect transistor, a trench is formed over a substrate. Nano-tube structures are arranged into the trench, each of which includes a carbon nanotube (CNT) having a gate dielectric layer wrapping around the CNT and a gate electrode layer over the gate dielectric layer. An anchor layer is formed in the trench. A part of the anchor layer is removed at a source/drain (S/D) region. The gate electrode layer and the gate dielectric layer are removed at the S/D region, thereby exposing a part of the CNT at the S/D region. An S/D electrode layer is formed on the exposed part of the CNT. A part of the anchor layer is removed at a gate region, thereby exposing a part of the gate electrode layer of the gate structure. A gate contact layer is formed on the exposed part of the gate electrode layer.

Method of manufacturing a semiconductor device and a semiconductor device

A NEMS device structure and a method for forming the same are provided. The NEMS device structure includes a substrate and an interconnect structure formed over the substrate. The NEMS device structure includes a dielectric layer formed over the interconnect structure and a beam structure formed in and over the dielectric layer, wherein the beam structure includes a plurality of strip structures. The NEMS device structure includes a cap structure formed over the dielectric layer and the beam structure and a cavity formed between the beam structure and the cap structure.

Semiconductor structures including two-dimensional (2-D) materials and methods of manufacture thereof are described. By implementing 2-D materials in transistor gate architectures such as field-effect transistors (FETs), the semiconductor structures in accordance with this disclosure include vertical gate structures and incorporate 2-D materials such as graphene, transition metal dichalcogenides (TMDs), or phosphorene.

2-D material transistor with vertical structure

Growing community of inventors

Hsin-Chu, Taiwan

Ken-Ichi Goto