Taiwan Semiconductor Manufacturing Comp. Ltd.

Macronix International Co., Ltd.

Ken Hui Chen

Pei-Haw Tsao

Chender Huang

Kuen Long Chang

Hank Huang

Jones Wang

Chun Hsiung Hung

Chia-Feng Cheng

Nai Ping Kuo

Su Chueh Lo

Yu Chen Wang

Chung Yu Wang

Su-Chueh Lo

Yi-Fan Chang

Han Sung Chen

Chung-Yu Wang

Kuo Yu Liao

Ching Chung Lin

Wen Yi Hsieh

Ta Kang Chu

Chu Ching Wu

Chun-Hsiung Hung

Kuen-Long Chang

Cheng Ming Yih

Pei Haw Tsao

Cheng-Ming Yi

A memory device includes an error code generator, one or more first pins coupled to an external data bus, and one or more second pins coupled to an external system interface. The one or more first pins output data chunks to the data bus during a period of memory operation; and the error code generator is configured to transmit a status code via the one or more second pins during the period of memory operation. The status code indicates at least one of an error was detected, an error was detected and corrected, or an error was detected and not corrected.

Method and device for monitoring data error status in a memory

An electronic device includes a processor coupled to a memory device, through a data bus to receive and transmit bits on the data bus. The processor is configured to transmit a message including a first bit indicative of controlling the data bus, address bits indicative of an address identifying the memory device, and a second bit indicative of whether the processor intends to read data from or write data to the memory device; and transmit a third bit indicative of a mode of operation of the memory device.

Electronic device and data exchange method including protocol indicative of modes of operation

A method for monitoring data error status of a memory device includes generating, by a memory controller, a data status indication code indicating error status of a data chunk transmitted by the memory controller and outputting, by the memory controller, the data status indication code to a user interface.

In accordance with the disclosure, there is provided a memory device configured to implement an error detection protocol. The memory device includes a memory array and a first input for receiving a control signal corresponding to a command cycle. The memory device also includes a second input for receiving an access control signal during a command cycle and for receiving an error detection signal during the command cycle, wherein the error detection signal includes information corresponding to the access control signal. The memory device further includes control logic configured to verify the correctness of the access control signal by a comparison with the error detection signal and perform an operation on the memory array during the command cycle when the correctness of the access control signal is verified.

Device and method for detecting controller signal errors in flash memory

A method for outputting data error status of a memory device includes generating data status indication codes indicating error status of data chunks transmitted by a memory controller, and combining the data status indication codes with corresponding data chunks to generate an output signal, and outputting the output signal to a data bus pin.

Monitoring data error status in a memory

A method for command processing in a memory controller includes receiving a serial input signal including a series of binary digits, capturing the binary digits at ones of odd locations or even locations of the serial input signal to form a first sub-series, capturing the binary digits at other ones of the odd locations or the even locations of the serial input signal to form a second sub-series, comparing the first and second sub-series, and performing a command represented by the first sub-series, if the first and second sub-series are complementary to each other.

Method and device for processing serial binary input by comparing binary digits at even and odd locations of the input

Various discussed approaches improve the over erase issue and the coupling effect, and include (A) multilevel contacts between (i) the first outer selected word line of an erase group, and (ii) the first unselected word line outside the ease group neighboring the first outer selected word line; (B) a sufficient separation distance between (i) the first outer selected word line of an erase group, and (ii) the first unselected word line outside the ease group neighboring the first outer selected word line. These are examples of electrically isolating (i) the first outer selected word line of an erase group, from (ii) the first unselected word line outside the ease group neighboring the first outer selected word line.

Method and apparatus of performing an erase operation on a memory integrated circuit

A method and apparatus for protecting non-volatile memory is described. A write command is processed only when an operating voltage is between specified operating limits and when a data pattern stored in the non-volatile memory is repeatedly read successfully.

Method and apparatus for protection of non-volatile memory in presence of out-of-specification operating voltage

A virtual ground nitride read-only memory array has a matrix of nitride read-only memory cells in which during an erase operation the non-erasing side of nitride read-only memory cells are connected to a common node for enhancing the erase uniformity of the nitride read-only memory array. If an operation requests erasing on the left side of nitride read-only memory cells, a positive voltage is supplied from an internal power supply to the left side for each of the nitride read-only memory cells, and the right side for each of the nitride read-only memory cells is discharged to a common node. The voltage level of the common mode is selected to be sufficiently high in order to prevent from punch through while at the same time sufficiently low to maintain the lateral electric field for erase operation to function optimally.

Structures and methods for enhancing erase uniformity in a nitride read-only memory array

A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.

Enhanced adhesion strength between mold resin and polyimide

A virtual ground NROM array has a matrix of NROM cells in which during an erase operation the non-erasing side of NROM cells are connected to a common node for enhancing the erase uniformity of the NROM array. If an operation requests erasing on the left side of NROM cells, a positive voltage is supplied from an internal power supply to the left side for each of the NROM cells, and the right side for each of the NROM cells is discharged to a common node. If an operation requests erasing the right side of NROM cells, a positive voltage is supplied from the internal power supply to the right side for each of the NROM cells, and the right side for each of the NROM cells is connected to the common node. The voltage level of the common mode is selected to be sufficiently high in order to prevent from punch through while at the same time sufficiently low to maintain the lateral electric field for erase operation to function optimally. In an alternative embodiment, non-erasing sides of NROM cells in the NROM array are connected to a current source during an erase operation for enhancing the erase uniformity of the NROM array. If an operation requests erasing the left side of NROM cells, a positive voltage is supplied from an internal power supply to the left side for each of the NROM cells, and the right side for each of the NROM cells is discharged to a current source. If an operation requests erasing the right side of NROM cells, a positive voltage is supplied from the internal power supply to the right side for each of the NROM cells, and the right side for each of the NROM cells is connected to the current source.

Structures and methods for enhancing erase uniformity in an NROM array

A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.

Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly

A new method is provided for the interconnection of flip chips to a supporting substrate. The invention starts with a conventional first substrate, that serves as a semiconductor device support structure, over the surface of which a first pattern of contacts points has been provided. The invention then uses a second substrate, for instance a glass or quartz plate, and creates over the surface thereof a second pattern of solder bumps separated by solder non-wettable surfaces. The second pattern is a mirror image of the first pattern. By then overlying the first pattern of contact points with the second pattern of solder bumps, a step of reflow can be applied to the solder bumps, transferring the solder bumps from the second substrate to the contact points provided over the first substrate.

Growing community of inventors

Hsinchu, Taiwan

Ken Hui Chen