Cpumate Inc.

Golden Sun News Techniques Co., Ltd.

Kitagawa Holdings, LLC

Golden Sun New Techniques Co., Ltd.

Ken Hsu

Kuo-Len Lin

Chih-Hung Cheng

Chen-Hsiang Lin

Hwai-Ming Wang

Wen-Jung Liu

Chiao-Li Huang

Hui-Min Tsui

Mong-Hua Hung

Jui-Ho Liu

Chih-Hsung Cheng

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane () and an attaching plane () perpendicular to each other, coating an adhesive () on the contact planes (), connecting the contact planes to make the attaching planes co-planar.

Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.

Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof

A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Heat sink having heat-dissipating fins capable of increasing heat-dissipating area

A heat dissipating structure of a lightweight lamp cupmade of a porous material includes a containing cavityat an end of the lamp cup, a lamp holderat another end of the containing cavity, a metal hoodsheathed with the lamp holderand covered onto an external side of the lamp cup, a heat conduction mediumbetween the lamp cupand the metal hood, and a light emitting unitcontained in the containing cavityof the lamp cup, such that the heat produced by the light emitting unitcan be conducted form the lamp cupto the metal hoodand dissipated from the metal hoodto the outside.

Heat dissipating structure of LED lamp cup made of porous material

A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Heat-dissipating fin capable of increasing heat-dissipating area

A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.

Heat-dissipating device having air-guiding cover

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane (') and an attaching plane (&#x2032;) perpendicular to each other, coating an adhesive () on the contact planes (&#x2032;), connecting the contact planes to make the attaching planes co-planar.

Method of manufacturing a heat conducting structure having a coplanar heated portion

A cooling rack structure includes a cooling plate (), a temperature conductor (), a centrifugal fan (), a cooling body () and a thermoelectric cooling component (). A temperature-super-conducting component () is disposed on an inner surface () of the cooling plate (). The temperature conductor () is arranged on the temperature-super-conducting component (). In addition, a heat-exhausting hole () is arranged on an upper side of the cooling plate (). The centrifugal fan () is disposed between the temperature conductor () and the heat-exhausting hole () while the cooling body () is disposed between the fan () and the heat-exhausting hole (). A hot side face () of the thermoelectric cooling component () closely contacts the cooling body () while a cold side face () is arranged on the temperature-super-conducting component (). By quickly conducting the low temperature generated from the thermoelectric cooling component () onto the cooling plate () through the temperature-super-conducting component (), a low temperature surface can be uniformly provided to obtain a cooling effect.

Cooling rack structure of thermoelectric cooling type

A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

Heat sink having heat-dissipating fins of large area and method for manufacturing the same

A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.

Method for embedding heat pipe into heat-conducting seat

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Method for manufacturing large-area heat sink having heat-dissipating fins

A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Method for manufacturing a heat sink

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

A heat-dissipating device () includes a casing () and a thermal insulation plate () provided within the casing (). The thermal insulating plate () divides the interior of the casing () into a first accommodating space () and a second accommodating space (). A hot air outlet () and a first air inlet () of the casing () are in communication with the first accommodating space (). A cold air outlet () and a second air inlet () of the casing () are in communication with the second accommodating space (). A thermoelectric cooling chip () is disposed in a through-hole () of the thermal insulation plate () and has a hot-end surface () facing the first accommodating space () and a cold-end surface () facing the second accommodating space (). A heat-dissipating module () is received in the first accommodating space (). A cold-airflow supplying module () is received in the second accommodating space (). The heat generated by the hot-end surface () is dissipated to the hot air outlet () by the thermal conduction of the heat-dissipating module (). The cold generated by the cold-end surface () is conducted and distributed uniformly by the cold-airflow supplying module () to the cold air outlet ().

Heat-dissipating device for supplying cold airflow

A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

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Wugu, Taiwan

Ken Hsu