Hitachi Metals, Ltd.

Neomax Materials Co., Ltd.

Tottori University

Ken Asada

Fumiaki Kikui

Masayuki Yokota

Junya Nishina

Keiichiro Maeda

Setsuo Andoh

Ryouji Inoue

Hiroki Sakaguchi

Hiroyuki Usui

Kazuya Nagatomo

A hermetic sealing cap includes a base material, a first plated layer formed on the base material, and a second plated layer formed on the first plated layer. A surface of the base material is sectioned into a first region, a second region not adjacent to the first region inside the first region, a third region adjacent to the first region inside the first region, and a fourth region adjacent to the first region outside the first region. In the third region and the fourth region, the first plated layer is exposed to be oxidized.

Hermetic sealing cap, electronic component housing package, and method for manufacturing hermetic sealing cap

This seal ring () is made of a clad material in which a base material layer () and a brazing filler metal layer () arranged on a first surface () of the base material layer are bonded to each other, and a side brazing filler metal portion () of the brazing filler metal layer covering a side surface () of the base material layer is removed.

Seal ring and method for manufacturing seal ring

This secondary battery negative electrode material constitutes an active material layer formed on a current collector layer of a secondary battery negative electrode and includes a Si particle and a coating material containing Ni and P, formed to cover a surface of the Si particle.

Secondary battery negative electrode material, secondary battery negative electrode, method for manufacturing secondary battery negative electrode material, and method for manufacturing secondary battery negative electrode

Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer.

Method of manufacturing composite ball for electronic parts

A separator for a fuel cell according to the present invention includes: a basecontaining 70 mass % or more of Al; an underlying layerbeing formed on the base and containing Ti; an intermediate layerbeing formed on the underlying layer and containing TiNx or TiOy; and a conductive metal layerbeing formed on the intermediate layer and containing Au or Pt. The separator for a fuel cell according to the present invention has an excellent anticorrosiveness although a base containing aluminum as a main component is used.

Fuel cell separator and method for producing the same

An electroless Ni&#x2014;P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni&#x2014;P plating; providing a solid piece including Ni, Ni&#x2014;P, Co or Co&#x2014;Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni&#x2014;P plated coating on the surface of the island portions. Thus, the present invention provides a Ni&#x2014;P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni&#x2014;P plating on an industrial basis.

Electroless Ni-P plating method and substrate for electronic component

A silver-coated ballaccording to the present invention includes: a spherical core; and a coating layerincluding silver superfine particles, which is arranged so as to surround the core. The silver superfine particles included in the coating layerhave a mean particle size of 1 nm to 50 nm.

Growing community of inventors

Izumi, Japan

Ken Asada