Intel Corporation

Kemel Aygun

Ravindranath Vithal Mahajan

Rajasekaran Swaminathan

Yidnekachew S Mekonnen

Christopher S Baldwin

A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.

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Chandler, AZ, United States of America

Kemel Aygun