Texas Instruments Corporation

Other

Kemal Tamer San

Cetin Kaya

Wei William Lee

Tito Gelsomini

Scott Robert Summerfelt

Akram Ali Salman

Freidoon Mehrad

Wah Kit Loh

John Anthony Rodriguez

Anand Seshadri

Craig Thomas Salling

Kezhakkedath Ramunni Udayakumar

Richard Allen Bailey

Michael Allen Ball

Huang-Chun Wen

Sunil Kumar Dusa

Jon Lescrenier

Antonio Guillermo Acosta

Md Abul Bashar Khan

An integrated circuit (IC), comprising a fuse structure (eFuse) formed in a resistive layer over a semiconductor substrate, the eFuse subject to a change in resistance through the controlled application of a programming current from a programming voltage source connected to a first terminal of the eFuse; a blow transistor formed on or over the substrate and having a control terminal configured to cause the programming current to flow through the eFuse in response to a programming signal; an intermediate transistor formed on or over the substrate and electrically coupled in series between a second terminal of the eFuse and the blow transistor; and, control circuitry formed on or over the substrate and electrically coupled to a node between the second terminal of the eFuse and the intermediate transistor, the control circuitry configured to reduce the flow of programming current through the eFuse in the event that a voltage detected at the node reaches a threshold level.

eFUSE programming feedback circuits and methods

Curing of a passivation layer applied to the surface of a ferroelectric integrated circuit so as to enhance the polarization characteristics of the ferroelectric structures. A passivation layer, such as a polyimide, is applied to the surface of the ferroelectric integrated circuit after fabrication of the active devices. The passivation layer is cured by exposure to a high temperature, below the Curie temperature of the ferroelectric material, for a short duration such as on the order of ten minutes. Variable frequency microwave energy may be used to effect such curing. The cured passivation layer attains a tensile stress state, and as a result imparts a compressive stress upon the underlying ferroelectric material. Polarization may be further enhanced by polarizing the ferroelectric material prior to the cure process.

Low-temperature passivation of ferroelectric integrated circuits for enhanced polarization performance

Thermal treatment of a semiconductor wafer in the fabrication of integrated circuits including MOS transistors and ferroelectric capacitors, including those using lead-zirconium-titanate (PZT) ferroelectric material, to reduce variation in the electrical characteristics of the transistors. Thermal treatment of the wafer in a nitrogen-bearing atmosphere in which hydrogen is essentially absent is performed after formation of the transistors and capacitor. An optional thermal treatment of the wafer in a hydrogen-bearing atmosphere prior to deposition of the ferroelectric treatment may be performed.

Thermal treatment for reducing transistor performance variation in ferroelectric memories

A method () for determining various bit failure modes in a static random access memory device. A hard/soft bit failure test sequence is performed on each cell of the memory device to determine whether the cell exhibits a hard bit failure or a soft bit failure, then a data retention test is performed on the cell having soft bit failure to determine whether the cell exhibits a data retention failure. A write or disturb test sequence is then performed on the cell not having data retention failure, and a read or disturb test sequence is performed on the cell having write or disturb failure. Finally, a disturb test sequence is performed on the cell having read or disturb failure, and then an analysis is performed on the data from the tests to determine whether the cell exhibits one of a write, read, or disturb failure.

Method for determining and classifying SRAM bit fail modes suitable for production test implementation and real time feedback

An information write-register embedded in an integrated circuit (IC) is made of a plurality of independently addressable gate-controlled components formed in an isolated p-well nested in a n-well. Gates over the p-well are positioned on an insulator geometrically formed so that it is susceptible locally to electrical conductivity upon applying an overstress voltage pulse, whereby binary information can be permanently encoded into the write-register. The overstress voltage pulse is applied between the gate and the p-well and is created when a write-enable pulse of predetermined polarity and duration is superposed by a p-well pulse of opposite polarity and shorter duration.

Anti-fuse structure and method of writing and reading in integrated circuits

Anti-fuse structure of writing and reading in integrated circuits

The method is for programming a memory cell in an array of cells having a plurality of bit lines, each with bit-line coupled cells, and a plurality of word lines, each with word-line coupled cells. A word line-bit line combination identifies a target cell. Each cell has a drain, source, gate and floating gate arrayed upon a base common to the cells, all of which cooperate to establish a floating gate-to-source field in each cell. The method includes the steps of: (a) applying a select signal to a word line and a bit line coupled with the target cell; (b) providing an adjusted signal to the bit-line coupled cells to decrease strength of the floating gate-to-drain field for the bit-coupled cells; (c) programming the target cell; and (d) maintaining the adjusted signal at least until the programming is complete.

Method and apparatus for programming flash memory device

A transistor is formed on an outer surface of a substrate The transistor comprises a floating gate and a control gate An outer encapsulation layer and sidewall bodies and comprise silicon nitride that is deposited in such a manner such that the material is transmissive to ultraviolet radiation. In this manner, the sidewall bodies and and the layer can be used as an etch stop during the formation of a drain contact . These layers will also permit the transmission of ultraviolet radiation to the floating gate to enable the erasure of floating gate

Semiconductor device architectures including UV transmissive nitride layers

A transistor,is formed on an outer surface of a substrate,. The transistor comprises a floating gate,and a control gate,. An outer encapsulation layer,and sidewall bodies,and,comprise silicon nitride that is deposited in such a manner such that the material is transmissive to ultraviolet radiation. In this manner, the sidewall bodies,and,and the layer,can be used as an etch stop during the formation of a drain contact,. These layers will also permit the transmission of ultraviolet radiation to the floating gate,to enable the erasure of floating gate

This invention provides a cost-effective, easy-to-integrate Flash EPROM cell array. Starting with a substrate (31) of first conductivity-type, a first diffusion (30) of second conductivity-type forms the sources (11), and the connections between sources, of all of the memory cells (10) of the array. A second diffusion (32) of first conductivity-type forms the channel of at least one memory cell (10) in the array. A floating gate (13) and a control gate (14) of that memory cell (10) are located over, and insulated from, a junction of the first diffusion and the second diffusion. A third diffusion (33) of second conductivity-type is isolated in the second diffusion (32) to form the drain (12) of the memory cell (10). During operation, only positive voltages may be used for programming and erasing of the cells (10), thus eliminating the need for negative voltages and for triple-well diffusions. The cell array of this invention requires little or no current for Fowler-Nordheim erase operation. Therefore, there is no need for wordline (15) decoding of large arrays. In addition to the above features, use of the cell array of this invention saves space by eliminating, in certain types of prior-art arrays, the need for space-consuming columnar metal source lines. In that same type of array, a self-aligned-source etch step and a self-aligned-source implant step are eliminated.

EPROM cell array using N-tank as common source

A system for testing and adjusting threshold voltages in flash EEPROMs is disclosed. The system includes a memory cell array (5) comprising a plurality of cell columns. Each cell column includes a plurality of memory cells (10). Each memory cell (10) has a control gate terminal (14), a drain terminal (12) and a source terminal 11. A control system comprising a wordline decoder (16), a column decoder (19) and a microprocessor (21) applies selected voltages to the respective terminals of the memory cells (10), and selects one of the plurality of cell columns for compaction verification. A detector (30) determines whether any one of the memory cells (10) of the selected cell column has a threshold voltage below a predetermined positive voltage, and supplies an output signal to the control system. The control system increases respective threshold voltages of the memory cells (10) of the selected cell column in response to the output signal of the detector (30).

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Plano, TX, United States of America

Kemal Tamer San