Qorvo Us, Inc.

Kelly M Lear

Jeffrey Miller

Jeffery D Galipeau

Nikolaus Klemmer

Thomas Scott Morris

Joseph Edward Geniac

Jeffrey Dekosky

Mihir Roy

Christine Blair

Rommel Quintero

Tarak A Railkar

Deepukumar M Nair

Mark C Woods

Jeffrey D Galipeau

Bradford Nelson

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

Electromagnetic shields with bonding wires for sub-modules

The present disclosure relates to a system in package having a chiplet with a first substrate and a first die deposed over the first substrate, a second die, a second substrate that the chiplet and the second die are deposed over, and a heatsink spreader deposed over the chiplet and the second die. Herein, the first substrate includes layered-cake shaped heatsink stanchions that are coupled to the first die, and the second substrate includes layered-cake shaped heatsink stanchions that are coupled to the chiplet and the second die. As such, heat generated by the first die can be dissipated by the heatsink stanchions within the first and second substrates, and heat generated by the second die can be dissipated by the heatsink stanchions within the second substrate. Furthermore, the heat generated by the first die and the second die can be dissipated by the heatsink spreader above them.

System in package with flip chip die over multi-layer heatsink stanchion

A reactance cancelling radio frequency (RF) circuit array is disclosed. The reactance cancelling RF circuit array includes multiple RF circuits each coupled to one or two adjacent RF circuits by one or two pairs of coupling mediums each having a respective length less than one-quarter wavelength. In one aspect, an RF input signal is first split across the RF circuits and then combined to form an RF output signal. As a result, each RF circuit requires a lower power handling capability to process a portion of the RF input signal. In another aspect, each pair of the coupling mediums can cause reactance cancellation in each reactance-cancelling pair of the RF circuits. By coupling the RF circuits via the coupling mediums and enabling splitting-combining among the RF circuits, it is possible to miniaturize the reactance cancelling RF circuit array for improved performance across a wide frequency spectrum.

Reactance cancelling radio frequency circuit array

Disclosed is a Bulk Acoustic Wave (BAW) assist filter structure with a BAW resonator stacked onto an integrated passive device (IPD). In exemplary aspects disclosed herein, the BAW filter structure includes a transducer with electrodes and a piezoelectric layer between the electrodes. The IPD is electrically coupled to the BAW resonator and provides a high frequency of operation. In such a configuration, the BAW assist filter structure has a low insertion loss and mitigates electrical length parasitic loss due to the close electrically proximity of the BAW resonator stacked onto the IPD. Further, the BAW assist filter structure is able to filter high frequencies and provides improved filter performance and greater flexibility in design of a filter transfer function.

Bulk acoustic wave resonator stacked onto an integrated passive device

The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.

Substrate with embedded active thermoelectric cooler

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Electromagnetic shields for sub-modules

A high isolation duplexer/quasi circulator with two quadrature couplers is disclosed. Isolation between a transmit (TX) port and receive (RX) port of the quasi circulator is improved through use of two quadrature couplers. The quadrature couplers are coupled such that a first TX-RX signal path (from the TX port to the RX port) is shifted at or near 180 degrees from a second TX-RX signal path. These paths cancel each other to provide a high level of isolation between the TX port and the RX port. There are two signal paths between an antenna (ANT) port and the quadrature couplers for both TX signals and RX signals. A phase shift circuit is coupled to the ANT port of one or both duplexers such that the signals passing through the quadrature couplers to the ANT port are combined substantially in phase.

High isolation duplexer/quasi circulator with two quadrature couplers

The present disclosure relates to a high power and low loss acoustic filter that includes a first node, a second node, a first power bypass path, and a first acoustic resonator (AR) path. The first power bypass path extends between the first node and the second node. The first AR path also extends between the first node and the second node, is in parallel with the first power bypass path, and includes at least one first acoustic resonator that form an acoustic resonator network. Herein, the first AR path has a notch filter response. The first power bypass path and the first AR path form a first filter cell that has a band-pass filter response.

Growing community of inventors

Longwood, FL, United States of America

Kelly M Lear