Texas Instruments Corporation

Other

Kelly Jay Taylor

Sanjeev Aggarwal

Theodore Sidney Moise

Satyavolu Srinivas Papa Rao

Asad Mahmood Haider

F Scott Johnson

John Wesley Hamlin

Simon Joshua Jacobs

Shin-Puu Jeng

Lindsey H Hall

Earl Vedere Atnip

Song Zheng

Christopher Murray Beard

Ed Burke

Raul Enrique Barreto

Scott Robert Summerfelt

Luigi Colombo

Amitava Chatterjee

Richard L Guldi

Wei-Yung Hsu

Mona M Eissa

Wei-Yan Shih

Keith Alan Joyner

James Norman Hall

Sharad Saxena

Purnendu K Mozumder

Changming Jin

William Craig McDonald

Gregory Boyd Shinn

Wei William Lee

Alfred J Griffin, Jr

K R Udayakumar

Mary Alyssa Drummond Roby

Molly Nelis Sing

Kathryn Anne Schuck

Thomas R Seha

Sean M Collins

J Scott Martin

Jeffrey W Ritchison

Doug Prinslow

Luigi Columbo

Van-Joy Tsai

Sirisha Kuchimanchi

Rajan Rajgopal

Win-Jae Jessie Yuan

Jose Antonio Martinez Soto

Jennifer Lynne Holm

Toby Linder

In an example, a method of manufacturing a MEMS device includes forming a via. The method also includes depositing metal in the via and depositing a first layer of a non-photoactive organic polymer on the metal. The method includes baking the first layer of the non-photoactive organic polymer. The method also includes depositing a second layer of the non-photoactive organic polymer on the first layer of the non-photoactive organic polymer after baking the first layer of the non-photoactive organic polymer. The method includes baking the second layer of the non-photoactive organic polymer. The method also includes etching the first layer and the second layer of the non-photoactive organic polymer.

System and method for array of MEMS elements

A device includes a first substrate. The device also includes a barrier structure including a metallic layer on the first substrate, where the barrier structure forms a cavity. The device also includes a second substrate on the metallic layer, where the metallic layer extends between the first substrate and the second substrate, and where the metallic layer includes a sloped edge that contacts the first substrate within the cavity.

Barrier structure within a microelectronic enclosure

Systems and methods for MEMS devices are disclosed. A microelectromechanical system (MEMS) device includes a substrate, and a MEMS structure supported by the substrate. The MEMS structure includes a first layer of a first material comprising a titanium aluminum alloy. The MEMS structure further includes an aluminum layer on the first layer.

System and method for MEMS devices

In an example, a method includes depositing an organic polymer layer on one or more material layers. The method also includes thermally curing the organic polymer layer. The method includes depositing a hard mask on the organic polymer layer and depositing a photoresist layer on the hard mask. The method also includes patterning the photoresist layer to expose at least a portion of the hard mask. The method includes etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer. The method also includes etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers.

Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers

A magnetic erasable writable material for large format applications is disclosed, and includes a cast polyvinylchloride film with a mount surface opposite an etched receiver surface. Also incorporated is a transparent polyester film that has a marking side with a first predetermined hardness and an opposite seal side, laminated to the receiver surface. The marking side includes a clear superstrate that has a second predetermined hardness and applied to the marking side of the polyester film to lower its surface energy. The receiver surface is treated to have a surface energy adjusted to enable improved adherence of printed and preformed graphic elements, which are encapsulated when laminated between the PET film and receiver surface. The superstrate includes a perfluoropolyether, a polyurethane, an acrylated polyurethane, and/or an acrylate resin to harden the material.

Erasable writable substrates and methods of manufacture

A system includes a hinge structure. The hinge structure includes four support posts and four hinges, each hinge coupled to an edge of a support post and to a plate of the hinge structure, where each hinge includes two 90° turns. The system also includes a mirror coupled to the hinge structure and an electrode structure coupled to the hinge structure.

Electrostatic actuator with 4-bit digital electrode

Erasable writable materials

An erasable writable material for large format applications is disclosed, and includes a cast polyvinylchloride film with a mount surface opposite an etched receiver surface. Also incorporated is a transparent polyester film that has a marking side with a hardness exceeding approximately shore D 79 and an opposite seal side, hermetically laminated to the receiver surface. The marking side includes a clear superstrate that has a hardness exceeding approximately shore D 90, which is applied to the marking side of the polyester film to lower surface energy below about 24 millinewtons per meter. The receiver surface is treated to have a surface energy exceeding about 45 millinewtons per meter, to enable improved adherence of printed and preformed graphic elements, which are encapsulated when laminated between the PET film and receiver surface. The superstrate includes a perfluoropolyether, a polyurethane, an acrylated polyurethane, and/or an acrylate resin to harden the material.

Large format erasable writable surfaces

A magnetic erasable writable material for large format applications is disclosed, and includes a cast polyvinylchloride film with a mount surface opposite an etched receiver surface. Also incorporated is a transparent polyester film that has a marking side with a hardness exceeding approximately shore D 79 and an opposite seal side, hermetically laminated to the receiver surface. The marking side includes a clear superstrate that has a hardness exceeding approximately shore D 90, which is applied to the marking side of the polyester film to lower surface energy below about 24 millinewtons per meter. The receiver surface is treated to have a surface energy exceeding about 45 millinewtons per meter, to enable improved adherence of printed and preformed graphic elements, which are encapsulated when laminated between the PET film and receiver surface. The superstrate includes a perfluoropolyether, a polyurethane, an acrylated polyurethane, and/or an acrylate resin to harden the material.

Erasable Writable Materials

In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.

Dielectric cladding of microelectromechanical systems (MEMS) elements for improved reliability

In described examples, a MEMS device is formed by forming a sacrificial layer over a substrate and forming a first metal layer over the sacrificial layer. Subsequently, the first metal layer is exposed to an oxidizing ambient which oxidizes a surface layer of the first metal layer where exposed to the oxidizing ambient, to form a native oxide layer of the first metal layer. A second metal layer is subsequently formed over the native oxide layer of the first metal layer. The sacrificial layer is subsequently removed, forming a released metal structure.

Use of metal native oxide to control stress gradient and bending moment of a released MEMS structure

A MEMS device is formed by forming a sacrificial layer over a substrate and forming a first metal layer over the sacrificial layer. Subsequently, the first metal layer is exposed to an oxidizing ambient which oxidizes a surface layer of the first metal layer where exposed to the oxidizing ambient, to form a native oxide layer of the first metal layer. A second metal layer is subsequently formed over the native oxide layer of the first metal layer. The sacrificial layer is subsequently removed, forming a released metal structure.

An illuminated nipple cover that directs light to a skin contact member, which may be translucent or clear. The skin contact member is covered with an opaque cover so the skin contact member is illuminated, and the opaque cover blocks light from being seen from the skin contact member.

Illuminated nipple cover

Growing community of inventors

Allen, TX, United States of America

Kelly Jay Taylor