Ge Inspection Technologies, Gmbh

Kelley E Yetter

James Norman Barshinger

Anand Hasmukh Desai

Jae Choi

John Pyle

Brian Van Corcelius

Leslie B Nye

An apparatus for connecting a multi-conductor cable of a first device to a pin grid array connector of a second device, wherein said apparatus comprises a first printed circuit board (PCB) for terminating the conductors of the cable, which are connected to a first PCB surface mounted connector mounted on the first PCB. The first PCB surface mounted connector is mated with a second PCB surface mounted connector mounted on a second PCB, on which a PCB surface mounted socket grid array is also mounted for mating to the pin grid array connector of the second device. This apparatus allows the same (i.e., standardized) multi-conductor cable with the same first PCB and the same first PCB surface mounted connector to be used regardless of what style connector is used by the second device.

Apparatus for connecting a multi-conductor cable to a pin grid array connector

An acoustic stack for ultrasonic transducers comprising a backing block, flexible printed circuit board, piezoelectric ceramic layer, and acoustic matching layer. The various components of the acoustic stack are bonded together using an adhesive material and high pressure in a lamination process. The piezoelectric ceramic layer is manufactured to provide electrical and acoustic isolation without the need for dicing through multiple layers of the acoustic stack. A flex circuit provides the necessary electrical connections to the electrically isolated electrodes of the piezoelectric ceramic layer.

Acoustic stack for ultrasonic transducers and method for manufacturing same

A transducer having a ceramic element in which the ceramic is elevated above a polymer and a method of manufacturing the transducer. The transducer comprises a piezo-composite element comprising a ceramic element embedded in epoxy. In an array, the ceramic elements may be in the form of posts. The plurality of ceramic elements is slightly elevated above the polymer and in staggered arrangement with the polymer. The element is manufactured by first grinding the face of the composite and removing damaged ceramic by acid etching the ceramic. The epoxy is removed by plasma etching so that the ceramic is above the epoxy. The composite is sputter plated so that a maximum temperature that could damage the plating is not exceeded. The ceramic is then poled so that a maximum temperature that could damage the plating is not exceeded. Contacts are then attached to the plating adjacent the ceramic.

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Lewistown, PA, United States of America

Kelley E Yetter