Beijing Naura Microelectronics Equipment Co., Ltd.

Keke Zhao

Lei Zhu

Bing Li

Jingfeng Wei

Hong Ji

Guodong Bian

Liren Han

Lixin Pei

A mixing inlet device of semiconductor processing equipment is arranged at a top of a process chamber of the semiconductor processing equipment and configured to input a process gas into the process chamber. The mixing inlet device includes a cover assembly and a mixing inlet block. A bottom of the cover assembly covers the top of the process chamber. The mixing channel is arranged in the cover assembly. The mixing inlet block is arranged at a center position at a top of the cover assembly and includes a plurality of inlet channels and a first annular chamber. A top of the first annular chamber communicates with the plurality of inlet channels, and a bottom of the first annular chamber communicates with the mixing channel of the cover assembly.

Semiconductor processing apparatus and mixing inlet device

The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a liner, and the liner includes an integrally formed body member and a cover member. The cover member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover member and the body member and may be configured to cool the cover member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.

Sputtering reaction chamber and process assembly of sputtering reaction chamber

Growing community of inventors

Beijing, China

Keke Zhao