Nanjing Li-hang Industry Institute of Bionic Technology Limited Company

Nanjing University of Aeronautics and Astronautics

Nanjing Adhesion Technology Co., Ltd

Keju Ji

Zhendong Dai

Yiqiang Tang

Jian Chen

Enhua Cui

Chunxia Zhao

Peiyun Gan

Cong Yuan

Yuanhua Qiao

A flat-pressing manufacturing method of a bionic adhesive structure based on a micro through-hole nickel-based mold is disclosed. The method includes the following steps: preparing a nickel-based mold with a micro through-hole array; placing the nickel-based mold on an elastic pad in a magnetic mold closing system; coating a liquid prepolymer uniformly on a backing, and placing a side of the backing coated with the liquid prepolymer on the nickel-based mold, covering a sealing diaphragm on the backing to separate a cavity into an upper chamber and a lower chamber, and performing a vacuum treatment on the lower chamber and an inflation treatment on the upper chamber to apply a uniform pressure on the backing layer and achieve a full filling of prepolymers with different viscosities; and after the filling is completed, curing and demolding to obtain the bionic adhesive structure.

Flat-pressing manufacturing method of bionic adhesive structure based on micro through-hole nickel-based mold

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

Preparation method of bionic adhesive material with tip-expanded microstructural array

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Nanjing, China

Keju Ji