Fujitsu Corporation

Keizou Takemura

Jie Wei

Masumi Suzuki

Michimasa Aoki

Kenji Katsumata

Mitsutaka Yamada

Yosuke Tsunoda

Makoto Suwada

Kazuhiro Nitta

Shinichirou Okamoto

Wei Jie

An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Electronic apparatus

An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Cooling jacket and electronic apparatus

An electronic apparatus includes a substrate, a heat radiating member which faces the substrate with a gap therebetween, a fixing assembly which fixes the heat radiating member to the substrate, a heat transfer plate disposed on a side of the substrate with respect to the heat radiating member, and a thermal bonding material which is interposed between the heat radiating member and the heat transfer plate, and has elasticity, wherein an electronic device is inserted between the substrate and the heat transfer plate.

An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

Information processing device and cooling unit

A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.

Method for manufacturing component built-in substrate

A cooling apparatus that cools first and second high density heat dissipation components provided in a housing including a fan that provide an air convection from one opening toward the other opening, the cooling apparatus having: a conduit that contacts the first heat dissipation component and that allows a coolant to pass there through; and a fin structure that contacts the conduit and that is provided on an upwind side of the second heat dissipation component.

Cooling apparatus and electronic equipment

A cooling auxiliary unit used for an accommodation room configured to accommodate an electronic apparatus includes a duct member that stands upon an ventilation hole provided on a raised floor, and has an air passage connected to the ventilation hole, and an opening connected to the air passage, and a fan that moves air along the air passage.

Cooling auxiliary unit and cooling system

A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant.

Board unit and electronic apparatus

A heat sink includes a first heat pipe having a flat plate-shape and a second heat pipe connected perpendicularly to the first heat pipe. The first heat pipe has a first wick provided along an inner surface thereof. The second heat pipe has a second wick provided along an inner surface thereof. Each of end portions of the first and second wicks in a connecting portion of the first and second heat pipes has a comb-toothed part formed in a convexoconcave form like teeth of a comb so that the first and second wicks are connected by the comb-toothed parts fitting to each other. The comb-toothed parts of the second wick traverses an interior of the first heat pipe and contacts with the first wick on an opposite side.

Growing community of inventors

Kawasaki, Japan

Keizou Takemura