Kabushiki Kaisha Toshiba

Keizo Tanaka

Yoshikazu Yomogihara

Shinichi Koyama

Tatsuya Hasegawa

Satoshi Yoshimura

Sanae Tokunaga

Masaichi Okubo

A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.

Thermocompression bonding method for electrically and mechanically connecting conductors

The present invention provides a manufacturing method of a flat-panel display unit and a carrier therefor which make it unnecessary to implement alignment in each step, except for alignment which require higher precision, by performing the alignment in advance in the pre-stage of a series of steps. The present invention also provides a manufacturing method of a flat-panel display unit which allows alignment with accuracy of about 50 to 100 .mu.m to be performed simply, reliably and quickly. According to the inventive manufacturing method, a display panel is mounted non-shiftably on the carrier and while being mounted thereon, is then carried between processing machines and is processed by the processing machines. In mounting the display panel on the carrier, it is aligned with the carrier in advance by visually aligning alignment marks thereof. In processing it by the processing machine, the carrier and the processing machine are put into a predetermined state in which they are aligned and thereby, the display panel is put into a state in which it is aligned with the processing machine.

Manufacturing method of flat-panel display unit, display panel carrier

Thermocompressing bonding method and thermocompressing bonding apparatus

Growing community of inventors

Himeji, Japan

Keizo Tanaka