Fujitsu Corporation

Keizo Takemura

Masahiro Suzuki

Junichi Ishimine

Yoshiaki Udagawa

Hisashi Kawashima

Haruhiko Yamamoto

Akihiko Fujisaki

Masahiro Mochizuki

Masahiro Miyo

Kenichi Fujii

Masumi Suzuki

Masuo Ohnishi

Tadashi Katsui

Jie Wei

Minoru Hirano

Kiyotaka Seyama

Jie Wie

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Liquid-cooled electronic apparatus

A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.

Method of controlling cooling device in portable electronic and cooling device therefor

A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

Cooling device for mounting module

Growing community of inventors

Kawasaki, Japan

Keizo Takemura