Taiyo Yuden Co., Ltd.

Keizo Kawamura

Toshimasa Suzuki

Jun Ogasawara

Hideki Ogawa

Toshiyuki Yagasaki

Masahiro Hayashi

Takashi Amano

Tetsuyuki Suzuki

Akitoshi Wagawa

Hakuo Kataoka

In an exemplary embodiment, a coil component includes: an element body partthat is formed containing a magnetic material; a coilthat is embedded within the element body partand constituted by a wound conductive wire; lead wiresthat are extended from the conductive wire and are led out from the coil; and terminal partsthat are joined to the lead wires; wherein tip partsof the lead wires, each having a prescribed length from the tip, are embedded in the element body partand also extend along the bottom faceof the element body part, and the terminal partsare joined to the tip partsof the lead wireson the bottom faceof the element body part

Coil component and electronic device

A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

In an exemplary embodiment, a coil component includes: an element body part; a coilembedded within the element body partand constituted by a wound conductive wire; lead wiresthat are each extended from the conductive wire and led out from the coil, and whose tip partsare each fixed to a bottom faceof the element body part; and terminal partsthat are each constituted by the tip partorand a metal memberorthat is joined to the tip partoron the bottom face, and also has an openingorat a position overlapping the tip partorin a direction intersecting the bottom face

An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of metal magnetic grains containing Fe which are bonded to each other by bonding of oxide film formed on each metal magnetic grain, and the shaft is more densely filled with the metal magnetic material than is the flange. The electronic component can achieve size reduction and frequency increase by improving the magnetic permeability while also improving the plating property for the terminal electrode.

Electronic component

Provided is an electronic component having a core that can achieve size reduction and frequency increase by improving the magnetic permeability further while also improving the plating property for the terminal electrode. An electronic component has a shaft, a flange formed at an end of the shaft and constituting a core together with the shaft, a coiled conductor wound around the shaft, and an electrode terminal formed on the flange and connected electrically to an end of the conductor; wherein the shaft and flange are made of a metal magnetic material, and the shaft is more densely filled with the metal magnetic material than is the flange.

To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000&#xb0; C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon. A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.

Ceramic composition and ceramic wiring board

A ceramic composition is provided with a glass based material including SiO,, Al,O,, B,O,, and at least one selected from a group of Cao and MgO, and particles dispersed in the glass based material. The particles includes CaSiO,or MgSiO,as a main component. A sintered state of the ceramic composition has an anti-bending strength of 1500 kg/cm,or higher.

Growing community of inventors

Takasaki, Japan

Keizo Kawamura