Hitachi Chemical Company, Ltd.

Technopolis Hakodata Industrial Technology Promotion Organization

Technopolis Hakodate Industrial Technology

Keizo Hirai

Yasushi Kurata

Masato Yoshida

Toranosuke Ashizawa

Hideji Kuwajima

Akihiro Sasaki

Toshihiko Akahori

Shozo Yamana

Hiroshi Wada

Junichi Kikuchi

Hisashi Kaga

Miho Kurihara

Hiroshi Nishizawa

Kenji Suzuki

Touichi Sakata

A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.

Thermoresistance adhesive and semiconductor device using the same

Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.

Electric circuit device having circuit conductors using an

Electroconductive paste

Growing community of inventors

Hitachi, Japan

Keizo Hirai