Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Jujo Paper Co., Ltd.

Keizaburo Yamaguchi

Akihiro Yamaguchi

Yoshimitsu Tanabe

Kenichi Sugimoto

Shoji Tamai

Masahiro Ohta

Tatsuhiro Urakami

Yuko Ishihara

Mitsunori Matsuo

Wataru Yamashita

Yuichi Okawa

Norimasa Yamaya

Hideaki Oikawa

Yukihiro Yoshikawa

Hisamichi Murakami

Midori Yamazaki

Tsutomu Ishida

Tadashi Kobayashi

Kiyoharu Hasegawa

Saburo Kawashima

Tadashi Asanuma

Makoto Asano

Yoshihiro Sakata

Akio Karasawa

Seiichi Masuko

Ichisaburo Nakamura

Yasuyuki Hatakeyama

Keiichi Fukuda

Toshiyuki Kataoka

Akira Yamamoto

Akira Hasegawa

Teruyuki Nagata

Masatoshi Takagi

Masaru Wada

Hiroyuki Akahori

Takayuki Kubo

Noboru Yamato

Koichi Machida

Mikio Kitahara

Motoyuki Torikai

Koutarou Asahina

Kisuke Osawa

Yoshimatsu Naka

Masayuki Ooe

Tatshuiro Urakami

In a novel method of homo- or copolymerization of vinyl chloride, a specified coating agent is applied on the surfaces of the portions which will become into contact with the vinyl chloride monomer during the polymerization process. The coating agent is in a form of an aqueous solution of a modified condensation product of phenol and aldehyde, the pH of the solution being adjusted in a range that the product is dissolved at an ambient temperature upon coating of the solution and separates out of the solution upon being heated on the surfaces. The wall surface of the polymerization tank and the like is then coated with a thin film of the coating agent having a uniform thickness and being strongly adhered to the wall surface, thereby providing an excellent effect of preventing adhesion of the product polymer to the wall surface.

Method of preventing scale adhesion to the surfaces of a polymerization tank

Disclosed are an aromatic hydroxycarboxylic acid resin represented by the following formula (1): ##STR1## wherein each A group is the same or different and individually represents a substituted or unsubstituted phenylene or naphthylene group, R.sup.1 represents a hydrogen atom or a C.sub.1-4 alkyl group, R.sup.2 represents a hydrogen atom or a C.sub.1-10 alkyl, C.sub.1-10 alkoxyl, nitro or hydroxyl group, l stands for an integer of 0-100, m stands for an integer of 0-20 and n stands for an integer of 0-3 with the proviso that m stands for an integer other than 0 when all of the A group represent an unsubstituted or substituted phenylene group, a preparation process thereof and use of the same.

Aromatic hydroxycarboxylic acid resins and their use

Disclosed are an aromatic hydroxycarboxylic acid resin represented by the following formula (1): ##STR1## wherein each A group is the same or different and individually represents a substituted or unsubstituted phenylene or naphthylene group, R.sup.1 represents a hydrogen atom or a C.sub.1-4 alkyl group, R.sup.2 represents a hydrogen atom or a C.sub.1-10 alkyl, C.sub.1-10 alkoxyl, nitro or hydroxyl group, l stands for an integer of 0-100, m stands for an integer of 0-20 and n stands for an integer of 0-3 with the proviso that m stands for an integer other than 0 when all of the A group represent an unsubstituted or substituted a group, a preparation process thereof and use of the same.

This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

Aromatic dinitro and diamino intermediates

Method of preventing scale adhesion to surfaces of polymerization tank

This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## , and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member. The polyimide or polyimide copolymer is outstanding in melt-flow stability, and has greatly improved processability and excellent heat resistance. Consequently, the polyimide or polyimide copolymer can be applied to structural materials, and electic . electronic appliances.

Polyimide intermediates

A polyimide resin composition substantially comprising 1 99.9.about.50 parts by weight of polyimide having recurring structural units of the formula ##STR1## and 2 0.1.about.50 parts by weight of a polyimide which improved melt flowability and is prepared by using 1,3-bis(3-aminophenoxy)benzene or 6,6'-bis(3-aminophenoxy)-3,3,3',3'-tetramethyl-1,1'-spirobiindane as essential diamine component, or polyether pyridine having recurring structural units of the formula: ##STR2## is disclosed. Further, a polyimide based resin composition comprising the polyimide resin composition or a polyimide copolymer obtained by using the above diamines and a fibrous reinforcement is disclosed. These compositions have remarkably good processability, excellent heat stability and repeated fatigue characteristics.

Polyimide resin composition

Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

Bismaleimide compounds

The present invention relates to an amorphous polyimide or a polyimide copolymer having a requisite structural unit consisting of one or more recurring structural units represented by the formula (1): ##STR1## wherein X is a direct bond, oxygen atom or sulfur atom, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually a hydrogen atom or methyl, and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member. Polyimide and the polyimide copolymer of the invention has excellent heat resistance, is outstanding in melt-flow stability, has greatly improved processability, and can be applied to structural materials, and electric- electronic appliances.

Polyimide

Readily soluble, amorphous polyimide, and preparation process of same

This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond. The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.

A color-developing composition comprises a multi-valent-metal-modified salicylic acid resin (Resin A) and a polycondensation resin (resin B) at a weight ratio of 90-30 to 10-70. Resin A is composed of 5-35 mole % of a structural unit (I) and 65-95 mole % of at least one structural unit (II) or 65-95 mole % of a coupled structural unit of at least one unit (II) and at least one unit (III) and has a weight-average molecular weight of 350-5,000. Resin B is composed of the unit (II) and/or the unit (III) and has a weight-average molecular weight of 350-5,000. ##STR1## wherein Z represents M/m, M being a metal ion of m valence and m being an integer; R.sub.1 and R.sub.2 represent H or a C.sub.1-12 alkyl, aralkyl, aryl or cycloalkyl group; R.sub.3 and R.sub.6 represent H or a C.sub.1-4 alkyl group; and R.sub.4 and R.sub.5 represent H or CH.sub.3.

Color-developing compositions and their use

A polyimide comprising a requisite structural unit having one or more recurring structural units of the formula: ##STR1## such as the structural units of the formula ##STR2## Further, the present invention relates to a novel aromatic diamine which has a perfluoro radical and can be used as a raw material monomer of the polyimide, and a process for preparing the same. The polyimide can have an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance.

Aromatic diamine and polyimide, and preparation process of same

Aromatic diamine compounds, bismalemide compounds, thermosetting resin

Growing community of inventors

Chiba, Japan

Keizaburo Yamaguchi