Northeastern University

Keith Warner

Chung M Chan

George B Cvijanovich

Paul M Zavracky

Nicol E McGruer

Rick H Morrison

George B Cyijanovich

A method of creating plastically deformed devices which have a three dimensional aspect. Micromechanical structures are created from a material which is plastically deformable and then a section of the structure is bent to an out-of-plane position and can be maintained there without being supported by other mechanical devices such as latches or hinges. The bending of the structures may be done mechanically, by electrostatic forces or by magnetic forces. The bending can also be done in a batch mode where a plurality of devices are bent at the same time as part of the same process. Fuses can be utilized to allow only a predetermined number of devices to be bent in batch mode. The fuses are later blown, thereby providing a plurality of devices which are relatively parallel to the substrate as well as a plurality of devices which are generally out-of-plane with respect to the substrate.

Method of forming plastically deformable microstructures

An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.

Micro emitter based low contact force interconnection device

An interconnection device for providing electrical connection between two separable conducting elements that requires less applied force than a standard ohmic connection device of the same connection area includes a surface of at least a first conducting element that includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.

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Warwick, RI, United States of America

Keith Warner