Motorola Corporation

Semiconductor Components Industries, LLC

Keith W Bailey

Prosanto K Mukerji

Gary R Lorenzen

Alexander James Elliott

Kent L Kime

Pablo Rodriguez

George C Chen

William L Fragale

Sury N Darbha

Timothy E Meko

A method of manufacturing semiconductor components ( ) includes assembling, packaging, and testing the semiconductor components ( ) while the semiconductor components ( ) are mounted on an adhesive layer ( ). The method of can also keep the semiconductor components ( ) mounted on the adhesive layer ( ) between each of the assembling, packaging, and testing steps.

Method of manufacturing semiconductor components

An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

Electronic component and method of manufacture

A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).

Method of manufacturing a semiconductor leadframe structure

Semiconductor leadframe structure compatible with differing bond wire

Growing community of inventors

Mesa, AZ, United States of America

Keith W Bailey