Hrl Laboratories, LLC

Raytheon Company

Coherent, Inc.

Keith V Guinn

Jonathan James Lynch

Peter David Brewer

Adam Franklin Gross

Alan Jon Jacobsen

William B Carter

James H Schaffner

Jeffrey L Rogers

David Kisailus

A cooler for diode-laser bars comprises a machined base including a water-input plenum and a water-output plenum, and a top plate on which the diode-laser bars can be mounted. A stack of three etched plates is provided between the base and first plate. The stack of etched plates is configured to provide a five longitudinally spaced-apart rows of eight laterally spaced-apart cooling-channels connected to the water-input and water-output plenums. Water flows in the cooling-channels and in thermal contact with the first plate.

Cooling apparatus for diode-laser bars

A heat transport structure is provided having a structural microtruss wick with a thermal transport medium associated with the microtruss wick for thermal energy transport by fluid and vapor transport between a heat source and a heat sink.

Microtruss based thermal heat spreading structures

In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments

An electrical assembly () includes a power IC such as a MOSFET () attached to a substrate module (). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first and second device ports, and a bottom surface comprising a third conductive device surface C associated with a third device port. A first foil element is bonded to the first conductive device surface(s) A and to each of the first conductive substrate surfaces (A, A) and provides a continuous conductive pathway from each conductive surface (A) to each other conductive surface (A) and to each conductive surface (A, A). A second foil element is bonded to the second conductive device surface(s) B and to the second conductive substrate surface Band provides a continuous conductive pathway from each device conductive surface (B) to the substrate conductive surface (B). A third foil element may be installed to electrically interconnect the discrete second device surfaces (B). The foil elements reduce interconnection parasitics and reduce charge and thermal energy density at device conductive surfaces as compared to wire bonded electrical interconnections. The foil elements may be comprised of formed metal elements that are flexible but sufficiently rigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

Method for interconnecting electrical device to a module

A multi-layered semiconductor apparatus capable of producing at least 500 W of continuous power includes at least two device substrates arranged in a stack. Each of the at least two device substrates has a first side and a second side opposite to the first side, and each of the at least two device substrates is configured to produce an average power density higher than 100 W/cm. A plurality of active devices are provided on the first side of each of the at least two device substrates. The plurality of active devices are radiatively coupled among the at least two device substrates. At least one of the at least two device substrates is structured to provide a plurality of cavities on its second side to receive corresponding ones of the plurality of active devices on the first side of an adjacent one of the at least two device substrates.

Multi-layered integrated circuit and apparatus with thermal management and method

A millimeter wave module for providing one pixel having a pixel resolution in a millimeter wave focal plane array includes a horn antenna having a first cross section area less than or equal to the pixel resolution, a detector for detecting the millimeter wave signals received by the horn antenna, the detector mounted in a recess in the horn antenna and having a second cross section area less than or equal to the first cross section area, and a video output adapter connected to the horn antenna and electrically connected to the detector for providing a connection from the detector, the video output adapter having a third cross section area less than or equal to the first cross section area.

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Thousand Oaks, CA, United States of America

Keith V Guinn