Nxp B.v.

Keith Richard Sarault

Antonius Hendrikus Jozef Kamphuis

Jeroen Johannes Maria Zaal

Amar Ashok Mavinkurve

Paul Southworth

Marcellinus Johannes Maria Geurts

Johannes Henricus Johanna Janssen

Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

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Nijmegen, Netherlands

Keith Richard Sarault