Texas Instruments Corporation

Cybex Technologies Corp.

Keith M Easton

Lawrence D Dyer

Jerry B Medders

James A Kennon

Anthony E Stephens

Frederick O Meyer, Iii

Frank Allen

Cedric Kentzler

Richard W Simpson, Jr

Apparatus for automatically placing a lid on a component package and then securing the lid with a clip. The apparatus includes a programmable robot arm having a gripping assembly, an inspection station, a first conveyor for conveying a boat along a path between a first position and a second position, a pick arm for removing a first lid from a lid feeder station, a second conveyor for reciprocating the pick arm between first and second positions to thereby transfer the first lid from the lid feeder station to the inspection station, and a camera located at the inspection station for inspecting the first lid. The apparatus further includes a rotary actuator arm and a mechanism for reciprocating the rotary actuator arm into contact with a first lid bottom surface following inspection of the first lid and for releasing the pick arm. A control program selectively controls the robot arm (i) to move the gripper assembly to the clip feeder station and to pick up a first clip during inspection of the first lid, (ii) to move the gripper assembly along with the first clip to the inspection station and to pick up the first lid following inspection of the first lid, and (iii) to move the gripper assembly along with the first clip and the first lid from the inspection station to a predetermined assembly position located along the path.

Method and apparatus for automatically placing lids on component packages

A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Method for polishing semiconductor wafer edges

A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

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Plano, TX, United States of America

Keith M Easton