Sheldahl, Inc.

Keith L Casson

Marion A Tibesar

Kenneth B Gilleo

Carol Rita Myers

Deanna Suilmann

Edward Mahagnoul

Eugene T Selbitschka

Kelly D Habeck

Matthew John Saari

Raphael A Marsolek

A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Method of manufacturing a multilayer electronic circuit

A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.

Printed wiring board with photoimageable dielectric base substrate and

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Multilayer electronic circuit having a conductive adhesive

Method for electrically and mechanically connecting at least two

An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.

Direct application of unpackaged integrated circuit to flexible printed

A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.

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Northfield, MN, United States of America

Keith L Casson