Learonal, Inc.

Rohm & Haas Electronic Materials LLC

Keith J Whitlaw

Michael P Toben

Craig Robinson

André Egli

Jeffrey N Crosby

Mark Goodenough

A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Tin plating method

A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.

Process for metallizing a through-hole board

Aqueous acid gold or gold alloy baths containing a substituted pyridine carboxylic acid, pyridine thiol, quinoline carboxylic acid, quinoline thiol, or a derivative or mixtures thereof, as an additive and methods of using such baths.

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Buxton, United Kingdom

Keith J Whitlaw