Texas Instruments Corporation

Wisconsin Alumni Research Foundation

Keith J Thompson

Yogesh B Gianchandani

John H Booske

Reid F Cooper

A method of bonding multiple layers is provided. The method includes the steps of stacking the multiple layers on top of each other and volumetrically heating the stack of multiple layers to a predetermined temperature. It is preferred that the stack is heated by electromagnetic induction.

Method of bonding a stack of layers by electromagnetic induction heating

According to one embodiment of the invention, a method for via etching in a dielectric material includes providing a wafer () having a substrate (), an etch stop layer () disposed outwardly from the substrate, an Organo-Silica-Glass layer () disposed outwardly from the etch stop layer (), and a photoresist layer () disposed outwardly from the Organo-Silica-Glass layer (), and positioning the wafer () within a process chamber (). The method further includes introducing a first source gas mixture () into the process chamber () to etch a first portion of the Organo-Silica-Glass layer () utilizing the first source gas mixture (), and introducing a second source gas mixture () into the process chamber () to etch, for a predetermined time period, a second portion of the Organo-Silica-Glass layer () down to the etch stop layer (). The second source gas mixture () includes a fluorocarbon, a noble gas, carbon monoxide, and nitrogen.

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Madison, WI, United States of America

Keith J Thompson