Lockheed Martin Corporation

Keith J Kasunic

Mark Goodnough

John G Donohue

Systems and methods of acquiring large field of view, high-resolution image data are discussed herein. Techniques and devices relate operation and composition of systems for acquiring large field of view, high-resolution image data. Such systems may include a first sensor chip assembly (SCA) in an interlaced focal plane array (FPA), the first SCA having a length, a width, and a resolution; a second SCA in the FPA, the second SCA having the same length, width, and resolution; and a field of view (FOV) adjustment device that moves the FOV of the FPA so that it can observe different scenes. In some such systems, the first and second SCAs are arranged relative to each-other in a first spaced array extending along a first dimension of the FPA such that there is an intentional gap between the first and second FPAs along the first dimension.

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Winter Garden, FL, United States of America

Keith J Kasunic