Novellus Systems Incorporated

Seagate Technology Incorporated

International Business Machines Corporation

Lam Research Corporation

Keith Freeman Wood

Damon Tyrone Genetti

Shawn M Hamilton

Chris Gage

Sheldon Templeton

Brad Vaughn Johnson

Christopher William Burkhart

Chunjer Chuck Cheng

Andrew Keith Hanlon

Matthew Jonathon Rodnick

Deborah Lynn Yaney

Eduardo Gatmaitan Canlas

James D Landess

A buffer station for thermal control of semiconductor substrates in a semiconductor substrate processing system is configured to interface with first and second vacuum transfer modules of the system so as to allow substrates to be transferred therebetween. The buffer station comprises a first vacuum transfer module interface configured to allow substrates to be transferred between the first vacuum transfer module and the buffer station, and a second transfer module interface configured to allow substrates to be transferred between the second vacuum transfer module and the buffer station. At least one buffer chamber between the first and second vacuum transfer module interfaces includes a lower pedestal configured to receive a substrate on a support surface thereof. One or more semiconductor substrate storage shelves are above the lower pedestal. Each shelf is configured to receive a substrate from the first or second vacuum transfer module and store the respective substrate thereon.

Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates

Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

Loadlock designs and methods for using same

A sealing assembly is provided for sealing retractable opposing planar surfaces of processing modules each having sealable cavities for the fabrication of semiconductor wafers. The sealing assembly may include an inner frame adapted to be concentrically positioned within a central opening of an outer frame. The outer frame may include lifting tabs attached to an upper portion such that the lifting tabs are graspable to removably position the sealing assembly between the opposing planar surfaces of the processing modules. An O-ring, which may include an elastomeric material, is adapted to fit about a circumference of the inner frame. The opposing surfaces of the processing modules define an opening therebetween which accepts the sealing assembly. The opposing surfaces of the modules are retractably movable towards one another thereby coupling the O-ring between the opposing planar surfaces to provide a seal.

MESC seal, O-ring carrier

An apparatus for minimizing axial and radial displacement of discs in a disc drive having a spindle motor hub rotatable about a central axis. The hub includes a substantially cylindrically shaped mounting surface at a selected radius about the central axis. The disc spacer comprises a substantially circular body having an inner surface at a first radius greater than the radius of the mounting surface, and a plurality of inwardly-facing spindle contact features projecting from the body. Each of the spindle contact features has a spindle contact surface at a second radius less than the radius of the mounting surface, with the spindle contact surfaces being operably configured to bear against the mounting surface when the disc spacer is coupled to the spindle motor hub. Preferably, intermediate portions of the body between adjacent spindle contact features deform to urge the spindle contact features toward the mounting surface.

Multi-point interference disc spacer for a disc drive

Embodiments include a disk drive having a drive motor assembly including at least one component selected from the group consisting of a rotatable hub, disk spacer, disk clamp, backiron, lower bearing bushing, and lower mounting flange. At least one of the components comprises a low sulfur outgassing free machining stainless steel material. The low sulfur outgassing free machining stainless steel material may include a free machining stainless steel that outgases sulfur at a rate insufficient to cause visually observable sulfide corrosion when tested by placing a copper strip into contact with the free machining stainless steel in an environment having a temperature of 50&deg; C. and 90% relative humidity for a 7 day test period and then observing the copper strip.

Low sulfur outgassing free machining stainless steel disk drive components

A disc mounting system for mounting the discs of a disc drive in a fixed radial relationship to the hub of a spindle motor, the disc mounting system including a composite disc spacer that maintains the discs in a fixed radial relationship to the spindle motor hub. The composite disc spacer includes a wedge member which supports a plurality of axially extending fingers which include inwardly and outwardly facing surfaces that bear against the spindle motor hub and against the bores of the discs to maintain the discs in a fixed concentric relationship to the spindle motor hub. The composite also has a spacer that extends about the wedge member to provide fixed relative axial spacing of the discs. The wedge member and the spacer interlock to facilitate handling of the composite disc spacer during assembly.

Growing community of inventors

Sunnyvale, CA, United States of America

Keith Freeman Wood