International Business Machines Corporation

Keith F Beckham

Horatio Quinones

David Clifford Long

David Carroll Challener

Krishna Seshan

James Marc Leas

Arunava Gupta

Karl J Puttlitz, Sr

Joseph M Harvilchuck

James R Lloyd

Morris Shatzkes

Kathleen M McGuire

Anne E Kolman

A method for causing an open circuit in an electrical conductor is provided, including the steps of: conducting a direct current through the conductor; and applying heat at a selected location on the conductor whereat it is desired to cause the open circuit of the conductor.

Method and apparatus for causing an open circuit in a conductive line

An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.

Solder interconnection structure for joining semiconductor devices to

Growing community of inventors

Wallkill, NY, United States of America

Keith F Beckham