Trikon Holdings Limited

Spts Technologies Limited

Trikon Technologies Limited

Keith Edward Buchanan

Stephen Robert Burgess

Paul Rich

Andrew Price

Mark Ian Carruthers

Daniel T Archard

Katherine Crook

Joon-Chai Yeoh

A plasma-enhanced chemical vapor deposition (PE-CVD) apparatus includes a chamber including a circumferential pumping channel, a substrate support disposed within the chamber, one or more gas inlets for introducing gas into the chamber, a plasma production device for producing a plasma in the chamber, and an upper and a lower element positioned in the chamber. The upper element is spaced apart from the substrate support to confine the plasma and to define a first circumferential pumping gap, and the upper element acts as a radially inward wall of the circumferential pumping channel. The upper and lower elements are radially spaced apart to define a second circumferential pumping gap which acts as an entrance to the circumferential pumping channel, in which the second circumferential pumping gap is wider than the first circumferential pumping gap.

PE-CVD apparatus and method

A low k porous dielectric film is described wherein the exposed surface or surfaces of the film are substantially non-porous. A densification method is described for treating such exposed surfaces to render porous surfaces non-porous.

Dielectric film

In a sputtering apparatus for depositing material onto a workpiece, an RF coil is disposed in a chamber between a first target and a workpiece support. The RF coil includes a re-sputtering surface of electrically conductive non-target material which faces towards the workpiece support and which receives a coating of target material for re-sputtering onto the workpiece. A second target, located between the RF coil and the workpiece support, includes a sputtering surface which faces towards the RF coil and which supplies at least a portion of thc coating of target material to the re-sputtering surface of the RF coil.

Sputtering apparatus

This invention relates to sputtering materials onto workpieces. Sputter Apparatus which is generally indicated at,is provided with additional D.C. coils,to increase uniformity of deposition.

Growing community of inventors

Monmouthshire, United Kingdom

Keith Edward Buchanan