Motorola Corporation

Keith D Soldner

Anthony B Suppelsa

Frank J Juskey, Jr

Barry M Miles

Bruce J Freyman

Mark A Tesh

Sandor Kalman

A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.

Transfer molded semiconductor device package with integral shield

A vision system for a robotic station which includes a camera for locating an object to be placed. The camera is mounted to a robotic manipulator which includes a gripper for holding the object. A mirror assembly deflects the images of the object such that it is captured by the camera. The mirror assembly comprises two face-to-face mirrors being angled at 45 degrees.

Vision system for a robotic station

Electrical interconnection of first and second sides of a flex circuit is provided by a tab formed in the flex circuit. At least one circuit trace extends along the tab and provides a contact area on the flex circuit first side. The tab is folded so that the contact area overlays the flex circuit second side. The contact area is then electrically interconnected as by reflow soldering to a contact area on the flex circuit second side.

Growing community of inventors

Coral Springs, FL, United States of America

Keith D Soldner