Intel Corporation

Keith D Jones

John Stephen Guzek

Javier Soto Gonzalez

Robert Starkston

Andrew David Talbot

Patrick Nardi

Christian E Iovin

Glenn Cochran

Aafreen Siddiqui

Shad Muegge

Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates.

Panel level fabrication of package substrates with integrated stiffeners

A system is disclosed for setting an electrical circuit parameter at a predetermined value. The system comprises a first electrical component having a first electrical parameter associated therewith. Sensing means generate a control signal indicative of the value of the first electrical parameter. A second electrical component has a second electrical parameter associated therewith, the value of which has a predetermined relation to the value of the first electrical parameter. Adjustment means receive the control signal generated by the sensing means; and, in response to the control signal being indicative that the electrical circuit parameter is not at the predetermined value, selectively connects or disconnects at least one further electrical component to or from the second electrical component thereby to provide said predetermined value.

System for setting an electrical circuit parameter at a predetermined value

Debugging a device, including a device having power-saving features, may include observing and controlling power state transitions.

Debugging power management

Improved materials for use in the fabrication of electronic devices and devices made therewith are described. The materials comprise fillers having a negative coefficient of thermal expansion.

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Phoenix, AZ, United States of America

Keith D Jones